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|Additional Physical Format:||Print version:
High-frequency integrated circuits.
Cambridge ; New York : Cambridge University Press, 2013
|Material Type:||Document, Internet resource|
|Document Type:||Internet Resource, Computer File|
|All Authors / Contributors:||
|ISBN:||9781107313927 1107313929 9781139021128 1139021125 9781107301092 1107301092 9781107306172 1107306175 9781107308374 1107308372|
|Description:||1 online resource.|
|Contents:||Preface; 1 Introduction; 1.1 High-frequency circuits in wireless, fiber-optic, and imaging systems; 1.2 A brief history of high-frequency integrated circuits; 1.2.1 The early days of GaAs MMICs; 1.2.2 Silicon bipolar, SiGe BiCMOS and CMOS RF, and fiber-optic ICs; 1.3 What does the future hold?; 1.3.1 New high-frequency circuit topologies; 1.3.2 New transistor architectures; 1.3.3 What would a 1THz electronic IC look like?; 1.4 The high-frequency IC design engineer; References; 2 High-frequency and high-data-rate communication systems. 2.1 Wireless and fiber-optic communication systems2.1.1 Wireless versus fiber systems; 2.2 Radio transceivers; 2.3 Modulation techniques; 2.3.1 Types of digital modulation; 2.3.2 Binary signals; 2.3.3 Amplitude shift keying; 2.3.4 Frequency shift keying; 2.3.5 Phase shift keying; 2.3.6 Carrier synchronization; 2.3.7 M-ary digital modulation schemes; 2.4 Receiver architectures; 2.4.1 Tuned homodyne receiver; 2.4.2 Heterodyne receiver; 2.4.3 Direct-conversion receiver; 2.5 Transmitter architectures; 2.5.1 Direct upconversion transmitter; 2.5.2 Single-sideband, two-step upconversion transmitter. 2.5.3 Direct modulation transmitter2.6 Receiver specification; 2.6.1 Fundamental limitations of dynamic range; 2.6.2 Noise, noise figure, and noise temperature; Noise factor and noise figure; Noise temperature; 2.6.3 Noise factor and noise temperature of a chain of two-ports; 2.6.4 Receiver noise floor and sensitivity; 2.6.5 Linearity figures of merit; How is the IIP3 plot generated?; Equations for calculating the mth-order intercept points and dynamic range; 2.6.6 Linearity of a chain of two-ports; 2.6.7 Optimizing the dynamic range of a chain of two-ports; 2.6.8 PLL phase noise. 2.7 Transmitter specification2.7.1 Output power; 2.7.2 EVM; 2.7.3 Transmit PSD mask; 2.7.4 Noise; 2.8 Link budget; 2.9 Phased arrays; 2.9.1 Timed versus phased arrays; 2.9.2 Properties of linear phased arrays; 2.9.3 Benefits of phased arrays; 2.9.4 Beam-forming transceiver architectures; 2.9.5 Switched-beam systems; 2.10 Examples of other system applications; 2.10.1 Doppler radar; 2.10.2 Remote sensing (passive imaging); Total power radiometer; Dicke radiometer; 2.10.3 Fiber-optic transceivers; 2.10.4 Backplane transceivers; Summary; Problems; References; Endnotes. 3 High-frequency linear noisy network analysis3.1 Two-port and multi-port network parameters; 3.1.1 Y-parameters; 3.1.2 Z-parameters; 3.1.3 H-parameters; 3.1.4 G-parameters; 3.1.5 ABCD-parameters; 3.1.6 The reflection coefficient and the Smith Chart; 3.1.7 Why S-parameters?; 3.1.8 Differential S-parameters; Differential, common-mode, and single-ended port impedances; 3.1.9 Two-port stability; 3.1.10 Two-port power gain definitions; 3.2 Noise; 3.2.1 Thermal noise, noise power, and noise temperature; 3.2.2 Noise in RLC single-ports; 3.2.3 Noise in diodes; 3.2.4 Noise in photodiodes.|
|Series Title:||Cambridge RF and microwave engineering series.|
'... the ideal companion for circuit designers wishing to grasp the challenges of circuit design above RF ... takes the reader from system specification down to the transistor and presents the