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High temperature electronics

Author: F Patrick McCluskey; Richard Grzybowski; Thomas Podlesak
Publisher: Boca Raton : CRC Press, ©1997.
Series: Electronic packaging series.
Edition/Format:   Print book : EnglishView all editions and formats
Database:WorldCat
Summary:

Offers coverage of high temperature electronics, including techniques, tradeoffs, best design practices and applications such as avionics and geothermal measurements.

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Document Type: Book
All Authors / Contributors: F Patrick McCluskey; Richard Grzybowski; Thomas Podlesak
ISBN: 0849396239 9780849396236
OCLC Number: 35744358
Description: 322 pages : illustrations ; 26 cm.
Contents: Ch. 1. Overview of High Temperature Electronics --
Ch. 2. Selection and Use of Silicon Device at High Temperatures --
Ch. 3. Wide Bandgap Semiconductors --
Ch. 4. Passive Device Selection and Use at High Temperature --
Ch. 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures --
Ch. 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures --
Ch. 7. Thermal Management for High Temperature Electronics --
Ch. 8. Applications --
Ch. 9. Accelerated Testing of Elevated Temperature Electronics.
Series Title: Electronic packaging series.
Responsibility: edited by F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak.
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