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Hybrid assemblies and multichip modules

Author: Fred W Kear
Publisher: New York : M. Dekker, ©1993.
Series: Manufacturing engineering and materials processing, 38.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:
Providing a unique description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules-illustrating how these products are created for a wide range of applications.
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Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: Fred W Kear
ISBN: 0824784669 9780824784669
OCLC Number: 26767567
Description: x, 278 pages : illustrations ; 24 cm.
Contents: 1. An overview of hybrid assemblies --
2. Design and development of hybrid assemblies --
3. Ceramic substrates --
4. Thick-Film and Thin-Film circuits --
5. Screened passive components --
6. Surface-Mount components --
7. Interconnection technologies --
8. Component placement and soldering --
9. Testing methods --
10. Coating, encapsulating, and marking --
11. Installing and using the hybrid assembly --
12. Quality assessment of hybrid assemblies --
13. Multichip modules
Series Title: Manufacturing engineering and materials processing, 38.
Responsibility: Fred W. Kear.
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Abstract:

Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how  Read more...

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