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I.E.E.E. transactions on electronics packaging manufacturing.

Author: Institute of Electrical and Electronics Engineers.; Components, Packaging & Manufacturing Technology Society.
Publisher: New York : Institute of Electrical and Electronics Engineers.
Edition/Format:   Journal, magazine : Periodical : English
Database:WorldCat
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Genre/Form: Periodicals
Material Type: Periodical
Document Type: Journal / Magazine / Newspaper
All Authors / Contributors: Institute of Electrical and Electronics Engineers.; Components, Packaging & Manufacturing Technology Society.
ISSN:1521-334X
OCLC Number: 711909496

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