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|All Authors / Contributors:||
Jennie S Hwant
|Description:||416 p. : ill. ; 23 cm.|
|Contents:||Chapter 1: Introduction Chapter 2: Manufacturing Implementation Approaches Chapter 3: Selecting Lead-Free Alloys for Solder Interconnections Chapter 4: Applying Solder Paste Chapter 5: Selecting Component Coating and PCB Surface Finish Chapter 6: Applying Mass Reflow Soldering Chapter 7: Wave Soldering and Selective Soldering Chapter 8: Compatibility and Cost Considerations Chapter 9: Other Manufacturing and Common Production Defect Considerations Chapter 10: Reliability and Accelerated Temperature Cycling Tests|
|Responsibility:||by Jennie S. Hwang.|
REVIEWED BY: Dr. George Riley, FlipChips Dot Com Dr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. It is the facilitator,