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Implementing lead-free electronics

Author: Jennie S Hwant
Publisher: New York ; London : McGraw-Hill, 2005.
Edition/Format:   Book : EnglishView all editions and formats
Database:WorldCat
Summary:

By June 2006 any company selling electronics into the European Union and China will have to convert to lead-free manufacturing processes. This book shows electronics manufacturers how to choose the  Read more...

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Document Type: Book
All Authors / Contributors: Jennie S Hwant
ISBN: 0071443746 9780071443746
OCLC Number: 57006797
Description: 416 p. : ill. ; 23 cm.
Contents: Chapter 1: Introduction Chapter 2: Manufacturing Implementation Approaches Chapter 3: Selecting Lead-Free Alloys for Solder Interconnections Chapter 4: Applying Solder Paste Chapter 5: Selecting Component Coating and PCB Surface Finish Chapter 6: Applying Mass Reflow Soldering Chapter 7: Wave Soldering and Selective Soldering Chapter 8: Compatibility and Cost Considerations Chapter 9: Other Manufacturing and Common Production Defect Considerations Chapter 10: Reliability and Accelerated Temperature Cycling Tests
Responsibility: by Jennie S. Hwang.

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REVIEWED BY: Dr. George Riley, FlipChips Dot Com Dr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. It is the facilitator, Read more...

 
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