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International Symposium on Advances in Interconnection and Packaging, 5-9 November 1990, Boston, Massachusetts

Author: Alfred P DeFonzo; Society of Photo-optical Instrumentation Engineers.; IEEE Components, Hybrids, and Manufacturing Technology Society.; IEEE Computer Society.
Publisher: Bellingham, Wash. : Society of Photo-optical Instrumentation Engineers, ©1991.
Series: Proceedings of SPIE--the International Society for Optical Engineering, v. 1389-1390.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
International Symposium on Advances in Interconnection and Packaging (1990 : Boston, Mass.).
International Symposium on Advances in Interconnection and Packaging.
Bellingham, Wash., USA : SPIE, ©1991
(OCoLC)551277331
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Alfred P DeFonzo; Society of Photo-optical Instrumentation Engineers.; IEEE Components, Hybrids, and Manufacturing Technology Society.; IEEE Computer Society.
ISBN: 081940456X 9780819404565 0819404578 9780819404572
OCLC Number: 25131957
Description: 2 volumes : illustrations ; 28 cm.
Contents: bk. 1. Microelectronic interconnects and packages : optical and electrical technologies: Plenary papers ; Electrical technologies ; Optical technologies --
bk. 2. Microelectronic interconnects and packages : system and process integration: Plenary papers ; System integration ; Process integration.
Series Title: Proceedings of SPIE--the International Society for Optical Engineering, v. 1389-1390.
Other Titles: Microelectronic interconnects and packages.
Advances in interconnection and packaging
Responsibility: Alfred P. DeFonzo, symposium chair/general editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of IEEE, Computer Society of IEEE.

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