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Introduction to microsystem packaging technology

Author: Yufeng Jin; Zhiping Wang; Jing Chen
Publisher: Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package  Read more...

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Document Type: Book
All Authors / Contributors: Yufeng Jin; Zhiping Wang; Jing Chen
ISBN: 9781439819104 1439819106
OCLC Number: 377864839
Description: xiii, 218 pages : illustrations ; 27 cm
Contents: IntroductionWhat are MicrosystemsRelated Fundamentals of MicrosystemsWhat is Microsystems PackagingWhat is Microelectronics PackagingHistory of Microelectronics PackagingStatus and Function of Microsystems Packaging TechnologyTechnical Challenges in Microsystems PackagingDesign Technique for Microsystems Packaging and IntegrationElectrical DesignThermal Management DesignMechanical DesignMicrofluidic DesignMulti-disciplinary DesignSubstrate TechnologyOrganic SubstrateCeramic SubstratesIntroduction of Typical Ceramic SubstratesLTCC SubstratesAdvanced SubstratesInterconnection TechnologyBraze-Welding TechnologyWire Bonding TechnologyTape Automated Bonding TechnologyFlip-Chip Bonding TechnologyChip Interconnection in System-level PackagingAdvanced interconnectionDevice Level PackageMetal PackagePlastic PackageCeramic PackageTypical Examples of Device-level PackageDevelopment ProspectMEMS PackagingFunction of MEMS Packaging Device Level Package for MEMSWafer Level Package for MEMSSealing TechniquesThin Film EncapsulationVacuum Packaging for MEMSCase StudyA 3D Wafer Level Hermetical Packaging for MEMSModule Assembly and Optoelectronic PackagingSurface Mount TechnologyPackaging of Flat Panel Display ModulesOptoelectronic PackagingSystem Level Packaging TechnologyOverviewSystem on Chip TechnologySystem in Package TechnologyRF System Package TechnologyReliabilityFundamentals of Reliability MethodologyWafer and Packaging-related Failure Mode and MechanismsReliability Qualification and AnalysisSummaryProspects for Microsystems Packaging TechnologyEvolvement of Packaging MaterialsEvolvement and Application of Packaging TechnologiesEvolution of Packaging Technologies and Environmental ProtectionConclusion RemarksReferences
Responsibility: Yufeng Jin, Zhiping Wang, Jing Chen.

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