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Introduction to microsystem packaging technology

Author: Yufeng Jin; Zhiping Wang; Jing Chen
Publisher: Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.
Edition/Format:   Print book : EnglishView all editions and formats

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package  Read more...


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Document Type: Book
All Authors / Contributors: Yufeng Jin; Zhiping Wang; Jing Chen
ISBN: 9781439819104 1439819106
OCLC Number: 377864839
Description: xiii, 218 pages : illustrations ; 27 cm
Contents: Introduction What are Microsystems Related Fundamentals of Microsystems What is Microsystems Packaging What is Microelectronics Packaging History of Microelectronics Packaging Status and Function of Microsystems Packaging Technology Technical Challenges in Microsystems Packaging Design Technique for Microsystems Packaging and Integration Electrical Design Thermal Management Design Mechanical Design Microfluidic Design Multi-disciplinary Design Substrate Technology Organic Substrate Ceramic Substrates Introduction of Typical Ceramic Substrates LTCC Substrates Advanced Substrates Interconnection Technology Braze-Welding Technology Wire Bonding Technology Tape Automated Bonding Technology Flip-Chip Bonding Technology Chip Interconnection in System-level Packaging Advanced interconnection Device Level Package Metal Package Plastic Package Ceramic Package Typical Examples of Device-level Package Development Prospect MEMS Packaging Function of MEMS Packaging Device Level Package for MEMS Wafer Level Package for MEMS Sealing Techniques Thin Film Encapsulation Vacuum Packaging for MEMS Case StudyA 3D Wafer Level Hermetical Packaging for MEMS Module Assembly and Optoelectronic Packaging Surface Mount Technology Packaging of Flat Panel Display Modules Optoelectronic Packaging System Level Packaging Technology Overview System on Chip Technology System in Package Technology RF System Package Technology Reliability Fundamentals of Reliability Methodology Wafer and Packaging-related Failure Mode and Mechanisms Reliability Qualification and Analysis Summary Prospects for Microsystems Packaging Technology Evolvement of Packaging Materials Evolvement and Application of Packaging Technologies Evolution of Packaging Technologies and Environmental Protection Conclusion Remarks References
Responsibility: Yufeng Jin, Zhiping Wang, Jing Chen.


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