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Introduction to microsystem packaging technology

Author: Yufeng Jin; Zhiping Wang; Jing Chen
Publisher: Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package  Read more...

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Genre/Form: Electronic books
Additional Physical Format: Print version:
Jin, Yufeng.
Introduction to microsystem packaging technology.
Boca Raton, FL : CRC Press/Taylor & Francis, ©2011
(DLC) 2009045580
(OCoLC)377864839
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Yufeng Jin; Zhiping Wang; Jing Chen
ISBN: 9781439865972 1439865973 9781628706727 1628706724
OCLC Number: 727983482
Description: 1 online resource (xiii, 218 pages) : illustrations
Contents: Ch. 1. Introduction --
ch. 2. Design technique for microsystems packaging and integration --
ch. 3. Substrate technology --
ch. 4. Interconnection technology --
ch. 5. Device-level packaging --
ch. 6. MEMS packaging --
ch. 7. Module assembly and optoelectronic packaging --
ch. 8. System-level packaging technology --
ch. 9. Reliability --
ch. 10. Prospects for microsystems packaging technology.
Responsibility: Yufeng Jin, Zhiping Wang, Jing Chen.
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Primary Entity

<http://www.worldcat.org/oclc/727983482> # Introduction to microsystem packaging technology
    a schema:CreativeWork, schema:MediaObject, schema:Book ;
    library:oclcnum "727983482" ;
    library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/263807067#Place/boca_raton_fl> ; # Boca Raton, FL
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/flu> ;
    schema:about <http://dewey.info/class/621.381046/e22/> ;
    schema:about <http://id.worldcat.org/fast/1019751> ; # Microelectronic packaging
    schema:about <http://experiment.worldcat.org/entity/work/data/263807067#Topic/technology_&_engineering_electronics_digital> ; # TECHNOLOGY & ENGINEERING--Electronics--Digital
    schema:about <http://experiment.worldcat.org/entity/work/data/263807067#Topic/technology_&_engineering_electronics_microelectronics> ; # TECHNOLOGY & ENGINEERING--Electronics--Microelectronics
    schema:bookFormat schema:EBook ;
    schema:contributor <http://viaf.org/viaf/102944816> ; # Zhiping Wang
    schema:contributor <http://experiment.worldcat.org/entity/work/data/263807067#Person/chen_jing_1974> ; # Jing Chen
    schema:copyrightYear "2011" ;
    schema:creator <http://viaf.org/viaf/102944800> ; # Yufeng Jin
    schema:datePublished "2011" ;
    schema:description "Ch. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology."@en ;
    schema:exampleOfWork <http://worldcat.org/entity/work/id/263807067> ;
    schema:genre "Electronic books"@en ;
    schema:inLanguage "en" ;
    schema:isSimilarTo <http://www.worldcat.org/oclc/377864839> ;
    schema:name "Introduction to microsystem packaging technology"@en ;
    schema:productID "727983482" ;
    schema:publication <http://www.worldcat.org/title/-/oclc/727983482#PublicationEvent/boca_raton_fl_crc_press_taylor_&_francis_2011> ;
    schema:publisher <http://experiment.worldcat.org/entity/work/data/263807067#Agent/crc_press_taylor_&_francis> ; # CRC Press/Taylor & Francis
    schema:url <http://www.crcnetbase.com/isbn/9781439865972> ;
    schema:url <http://site.ebrary.com/id/10603086> ;
    schema:url <http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=481049> ;
    schema:url <http://app.knovel.com/hotlink/toc/id:kpIMPT0004/introduction-to-microsystem> ;
    schema:url <http://www.myilibrary.com?id=692499> ;
    schema:url <http://public.eblib.com/choice/publicfullrecord.aspx?p=1026849> ;
    schema:workExample <http://worldcat.org/isbn/9781628706727> ;
    schema:workExample <http://worldcat.org/isbn/9781439865972> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/727983482> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/263807067#Agent/crc_press_taylor_&_francis> # CRC Press/Taylor & Francis
    a bgn:Agent ;
    schema:name "CRC Press/Taylor & Francis" ;
    .

<http://experiment.worldcat.org/entity/work/data/263807067#Person/chen_jing_1974> # Jing Chen
    a schema:Person ;
    schema:birthDate "1974" ;
    schema:familyName "Chen" ;
    schema:givenName "Jing" ;
    schema:name "Jing Chen" ;
    .

<http://experiment.worldcat.org/entity/work/data/263807067#Place/boca_raton_fl> # Boca Raton, FL
    a schema:Place ;
    schema:name "Boca Raton, FL" ;
    .

<http://experiment.worldcat.org/entity/work/data/263807067#Topic/technology_&_engineering_electronics_digital> # TECHNOLOGY & ENGINEERING--Electronics--Digital
    a schema:Intangible ;
    schema:name "TECHNOLOGY & ENGINEERING--Electronics--Digital"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/263807067#Topic/technology_&_engineering_electronics_microelectronics> # TECHNOLOGY & ENGINEERING--Electronics--Microelectronics
    a schema:Intangible ;
    schema:name "TECHNOLOGY & ENGINEERING--Electronics--Microelectronics"@en ;
    .

<http://id.worldcat.org/fast/1019751> # Microelectronic packaging
    a schema:Intangible ;
    schema:name "Microelectronic packaging"@en ;
    .

<http://viaf.org/viaf/102944800> # Yufeng Jin
    a schema:Person ;
    schema:familyName "Jin" ;
    schema:givenName "Yufeng" ;
    schema:name "Yufeng Jin" ;
    .

<http://viaf.org/viaf/102944816> # Zhiping Wang
    a schema:Person ;
    schema:birthDate "1962 October 6" ;
    schema:familyName "Wang" ;
    schema:givenName "Zhiping" ;
    schema:name "Zhiping Wang" ;
    .

<http://worldcat.org/isbn/9781439865972>
    a schema:ProductModel ;
    schema:isbn "1439865973" ;
    schema:isbn "9781439865972" ;
    .

<http://worldcat.org/isbn/9781628706727>
    a schema:ProductModel ;
    schema:isbn "1628706724" ;
    schema:isbn "9781628706727" ;
    .

<http://www.worldcat.org/oclc/377864839>
    a schema:CreativeWork ;
    rdfs:label "Introduction to microsystem packaging technology." ;
    schema:description "Print version:" ;
    schema:isSimilarTo <http://www.worldcat.org/oclc/727983482> ; # Introduction to microsystem packaging technology
    .


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