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Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.

Author: P Muralt; Materials Research Society.; Materials Research Society. Fall Meeting
Publisher: Warrendale, Pa. : Materials Research Society, ©2004.
Series: Materials Research Society symposia proceedings, v. 783.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Database:WorldCat
Summary:

This book, first published in 2004, focuses on the materials technologies that are key to the advancement of high-frequency devices.

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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication, Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: P Muralt; Materials Research Society.; Materials Research Society. Fall Meeting
ISBN: 1558997210 9781558997219
OCLC Number: 55227731
Notes: "This volume is a collection of half of the papers given at Symposium B, the first MRS symposium on 'Materials, Integration and Packaging Issues for High-Frequency Devices, ' held December 1-3 at the 2003 MRS Fall Meeting in Boston, Massachusetts."--Page xi.
Description: xiii, 232 pages : illustrations ; 24 cm.
Contents: Low-Temperature Co-Fired Ceramics Microwave Dielectrics --
Low Sintering Temperature of CuO-Fluxed Ag(Nb, Ta)O[subscript 3] Dielectric Ceramics / Chiping Wang, Thomas Shrout, Gaiying Yang, Hyo-Tae Kim, Do-Kyun Kwon, Michael T. Lanagan 3 --
Wireless and RF Module Packaging Using Low Loss Ceramic and Low Loss Organic Materials / James J. Logothetis, Daniel I. Amey, Timothy P. Mobley 13 --
Material Issues of Low Temperature Co-Fired Ceramic (LTCC) Fine Pitch Chip Scale Package (CSP) Designs / Megan M. Owens, Joseph W. Soucy, Thomas F. Marinis, Kevin A. Bruff, Henry G. Clausen 23 --
Techniques for Assessing the Performance of Circuit Materials at Microwave and Millimeter-Wave Frequencies / Charles E. Free 29 --
Theoretical and Experimental Study of Barium Zinc-Cadmium Tantalate-Based Microwave Dielectrics / Shaojun Liu, Mark Van Schilfgaarde, Jian Sun, Louisa Badd, David Smith, Novak S. Petrovixc, R. Taylor, N. Newman 35 --
A New Dielectric Material System of xLa(Mg[subscript 1/2]Ti[subscript 1/2])O[subscript 3]-(1-x)CaTiO[subscript 3] at Microwave Frequency / Yuan-Bin Chen, Cheng-Liang Huang, Che-Win Row 41 --
Ordered Structures in Ba(Cd[subscript 1/3]Ta[subscript 2/3])O[subscript 3] Microwave Ceramics: A Transmission Electron Microscopy Study / J. Sun, S.J. Liu, N. Newman, David J. Smith 47 --
Microwave Dielectric Properties of (1-x)CaTiO[subscript 3]-xNd (Mg[subscript 1/2]Ti[subscript 1/2])O[subscript 3]) Ceramics System / Cheng-Liang Huang, Yuan-Bin Chen, Ching-Wen Lo 53 --
Microwave Dielectric Properties of LaScO[subscript 3]-TiO[subscript 2] Materials / Do-Kyun Kwon, Michael T. Lanagan, Thomas R. Shrout 59 --
Dielectric Properties of BaTiO[subscript 3] Based Ceramics Prepared From Nano-Powders / Xiao-Hui Wang, Ren-Zheng Chen, Zhi-Lun Gui, Long-Tu Li 65 --
The Microstructures and Grain Boundary Segregations of Ceramic Barium Titanate Processed in Microwave Field / Hanxing Liu, Zhongqin Tian, Jian Zhou, Hongtao Yu, Long Zou, Shixi Ouyang 71 --
RF-MEMS Thin Film Materials --
RF-MEMS: Materials and Technology, Integration and Packaging / Harrie A.C. Tilmans 79 --
Photodefinable Metal Oxide Dielectrics: A Novel Method for Fabricating Low Cost RF Capacitive MEMS Switches / Guoan Wang, Augustin Jeyakumar, John Papapolymerou, Clifford L. Henderson 91 --
High-Q Integrated RF Passives and RF-MEMS on Silicon / Joost T.M. van Beek, Marc H.W.M. van Delden, Auke van Dijken, Patrick van Eerd, Andre B.M. Jansman, Anton L.A.M. Kemmeren, Theo G.S.M. Rijks, Peter G. Steeneken, Jaap den Toonder, Mathieu J.E. Ulenaers, Arnold den Dekker, Pieter Lok, Nick Pulsford, Freek van Straten, Lenhard van Teeffelen, Jeroen de Coster, Robert Puers 97 --
In-Plane Ferroelectricity in Strontium Titanate Thin Films / K.F. Astafiev, V.O. Sherman, M. Cantoni, A.K. Tagantsev, N. Setter, P.K. Petrov, T. Kaydanova, D.S. Ginley 109 --
Tunability of Bi-Rich BZN Cubic Pyrochlore Thin Films by Reactive Sputtering / Dong Hyuk Back, Yoon Seop Lee, Young Pyo Hong, Joong Ho Moon, Kyung Hyun Ko 115 --
Solidly Mounted Bulk Acoustic Wave Filters / H.P. Loebl, C. Metzmacher, R.F. Milsom, A. Tuinhout, P. Lok, F. van Straten 121 --
Investigation of Highly c-Axis Oriented AIN Thin Film Re-Growth / F. Martin, P. Muralt, M.-A. Dubois 133 --
Pulsed DC Reactive Magnetron Sputtering of AIN Thin Films on High Frequency LTCC Substrates / Jung W. Lee, Jerome J. Cuomo, Baxter F. Moody, Yong S. Cho, Roupen L. Keusseyan 139 --
Cu-Compatible Ultra-High Permittivity Dielectrics for Embedded Passive Components / Jon F. Ihlefeld, Angus I. Kingon, William Borland, Jon-Paul Maria 145 --
Passive Isolators Based on Barium Ferrite Sputtered Films / M. Le Berre, S. Capraro, J.P. Chatelon, H. Joisten, T. Rouiller, B. Bayard, D. Barbier, J.J. Rousseau 151 --
High-Density, Low-Loss MOS Decoupling Capacitors Integrated in a GSM Power Amplifier / F. Roozeboom, A. Kemmeren, J. Verhoeven, E. van den Heuvel, H. Kretschman, T. Fric 157 --
Packages, Substrates, Bonding and Interconnects --
High Frequency, High Density Interconnect Using AC Coupling / Paul Franzon, Angus Kingon, Stephen Mick, John Wilson, Lei Luo, Karthik Chandrasakhar, Jian Xu, Salvatore Bonafede, Alan Huffman, Chad Statler, Richard LaBennett 165 --
Design and Performance of Polymeric Ultra-Thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems With Ferroelectric Particles / John Andresakis, Takuya Yamamoto, Pranabes Pramanik, Nick Buinno 171 --
High Frequency Loss Mechanism in Polymers Filled With Dielectric Modifiers / J. Obrzut, A. Anopchenko, K. Kano, H. Wang 179 --
Rapid Prototype Fabrication of Custom Chip Scale Packages / Megan M. Owens, Joseph W. Soucy, Thomas F. Marinis, Henry G. Clausen 185 --
Surface Oxide Evolution on Al-Si Bond Wires / Wentao Qin, Ray Doyle, Tom Scharr, Mahesh Shah, Mike Kottke, Dennis Werho, N. David Theodore 191 --
Preparation and Use of Chip Capacitors in Ultra-Dense Multi-Chip Modules / D. Pryputniewicz, C. Kondoleon, J. Haley, T. Marinis 197 --
Semiconductor Structures --
High Electron Mobility SiGe/Si Transistor Structures on Sapphire Substrates / Samuel A. Alterovitz, Carl H. Mueller, Edward T. Croke, George E. Ponchak 205 --
Microstructural Evolution of Cu/Ta/GaAs Multilayers With Thermal Annealing / Wei-Cheng Wu, Chang-You Chen, Chen-Shih Lee, Edward Yi Chang, Li Chang 211 --
Integration of III-V Optoelectronic Components on Si Platform / Alex Katsnelson, Vadim Tokranov, Michael Yakimov, Serge Oktyabrsky 217 --
Improvement of Tantalum Pentoxide Metal-Insulator-Metal Capacitors for SiGe RF BiCMOS Technology / Hongjiang Sun, Ka Man Lau, Eyup Aksen, Nancy Bell 223.
Series Title: Materials Research Society symposia proceedings, v. 783.
Responsibility: editors, P. Muralt [and others].
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