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MEMS and nanotechnology. Volume 5 : proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics

Author: Gordon Shaw
Publisher: Cham : Springer, [2013?] ©2014
Series: Conference proceedings of the Society for Experimental Mechanics series
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
Database:WorldCat
Summary:
MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices &  Read more...
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Details

Genre/Form: Electronic books
Conference proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Gordon Shaw
ISBN: 9783319007809 3319007807
OCLC Number: 859668218
Notes: International conference proceedings.
Description: 1 online resource (viii, 134 pages) : illustrations.
Contents: Warpage Measurement of Simulated Electronic Packaging Assembly / Ningning Du, George F. Raiser and W. Carter Ralph --
Nanomechanical Characterization of Lead Free Solder Joints / Md Hasnine, Muhannad Mustafa, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack [and 2 others] --
In-Situ Surface Mount Process Characterization Using Digital Image Correlation / Satyajit Walwadkar, Christopher Kovalchick, Wade Hezeltine, Frank Liang and Alan McAllister --
Acoustic Waveform Energy as an Interconnect Damage Indicator / W. Carter Ralph, Gregory L. Daspit, Andrew W. Cain, Elizabeth E. Benedetto [and 3 others] --
Shape Optimization of Cantilevered Piezoelectric Devices / Naved A. Siddiqui, Seon-Bae Kim, Dong-Joo Kim, Ruel A. Overfelt and Barton C. Prorok --
Unique Fabrication Method for Novel MEMS Micro-contact Structure / Benjamin Toler, Brent Danner, Derrick Langley and Ronald Coutu Jr. --
A Frequency Selective Surface Design Fabricated with Tunable RF Meta-Atoms / Derrick Langley, Ronald A. Coutu Jr. and Peter J. Collins --
Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-robotics / LaVern A. Starman and Vladimir Vasilyev --
MEMS Cantilever Sensor for Photoacoustic Detection of Terahertz Radiation / Nathan E. Glauvitz, Ronald A. Coutu Jr., Michael Kistler, Ivan R. Medvedev and Douglas T. Petkie --
In-Plane MEMS Acoustic Emission Sensors Development and Experimental Characterization / Hossain Saboonchi and Didem Ozevin --
New Insight into Pile-up in Thin Film Indentation / MariAnne Sullivan and Barton C. Prorok --
Mapping the Mechanical Properties of Alloyed Magnesium (AZ 61) / Jennifer Hay and Phillip Agee --
Temperature Dependent Micromechanical Testing on the Formation of Cu/Sn Intermetallic Thin Films / F.-C. Hsu, F.-C. Lu, C.-T. Huang and M.-T. Lin --
Molecular Interactions on InxGa1-xN / L. E. Bain, A. M. Hosalli, S. M. Bedair, T. Paskova and A. Ivanisevic --
Timoshenko Beam Model for Lateral Vibration of Liquid-Phase Microcantilever-Based Sensors / Joshua A. Schultz, Stephen M. Heinrich, Fabien Josse, Isabelle Dufour [and 3 others] --
Improvement in Uncertainty of Tuning Fork-Based Force Sensor Stiffness Calibration via the Indentation Method Using Direct Determination of Contact and Machine Compliance / Gordon A. Shaw --
Flexible Terahertz Metamaterials for Frequency Selective Surfaces / J. A. Deibel, H. R. Jones, A. Fosnight, R. Shaver, E. Best, D. Langley, L. A. Starman and R.A. Coutu.
Series Title: Conference proceedings of the Society for Experimental Mechanics series
Responsibility: Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong, editors.
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Abstract:

MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology.

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