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MEMS and nanotechnology. Volume 5 : proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics

Author: Gordon Shaw
Publisher: Cham : Springer, [2013?] ©2014
Series: Conference proceedings of the Society for Experimental Mechanics series
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
Database:WorldCat
Summary:
MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices &  Read more...
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Genre/Form: Electronic books
Conference proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Gordon Shaw
ISBN: 9783319007809 3319007807
OCLC Number: 859668218
Notes: International conference proceedings.
Description: 1 online resource (viii, 134 pages) : illustrations.
Contents: From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly --
Nanomechanical Characterization of Lead Free Solder Joints --
In-Situ Surface Mount Process Characterization Using Digital Image Correlation --
Acoustic Waveform Energy as an Interconnect Damage Indicator --
Shape Optimization of Cantilevered Piezoelectric Devices --
Unique Fabrication Method for Novel MEMS Micro-contact Structure --
A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms --
Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.
Series Title: Conference proceedings of the Society for Experimental Mechanics series
Responsibility: Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong, editors.
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Abstract:

MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology.

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