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MEMS packaging

Author: Tai-Ran Hsu; INSPEC (Information service)
Publisher: London : INSPEC, ©2004.
Series: EMIS processing series, no. 3.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:

This book discusses the practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). Assembly, packaging and testing of MEMS and mircrosystems, from  Read more...

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Genre/Form: Electronic books
Additional Physical Format: Print version:
MEMS packaging.
London : INSPEC, ©2004
(OCoLC)53030765
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Tai-Ran Hsu; INSPEC (Information service)
ISBN: 9781849190626 1849190623 9781615839629 1615839623
OCLC Number: 692197050
Reproduction Notes: Electronic reproduction. [S.l.] : HathiTrust Digital Library, 2010. MiAaHDL
Description: 1 online resource (xxix, 275 pages) : illustrations.
Details: Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
Contents: Chapter 1: Fundamentals of MEMS packagingChapter 2: Joining and bonding technologiesChapter 3: Sealing technologiesChapter 4: Packaging of microsystemsChapter 5: Automated micro assemblyChapter 6: Testing and design for testChapter 7: MEMS packaging in the life sciencesChapter 8: RF and optical packaging telecommunications and other applicationsChapter 9: Aerospace applications
Series Title: EMIS processing series, no. 3.
Responsibility: edited by Tai-Ran Hsu.

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