skip to content
Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability Preview this item
ClosePreview this item
Checking...

Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability

Author: Ming He; T -M Lu
Publisher: New York : Springer, ©2012.
Series: Springer series in materials science, v. 157.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

This book presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces. It offers a clear account of the relationship between interface science and its  Read more...

Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

 

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Document Type: Book
All Authors / Contributors: Ming He; T -M Lu
ISBN: 9781461418115 1461418119 9781461418122 1461418127
OCLC Number: 776675131
Description: xi, 149 pages : illustrations (some color) ; 24 cm.
Contents: Preface1. Introduction1.1 Metal-dielectric interfaces in IC chips1.2 Materials choices1.3 Thermal and electrical stability2. Metal-Dielectric Diffusion Processes: Fundamentals2.1 Thermal diffusion2.2 Field-enhanced ion drift2.3 Thermodynamics and chemical interactions2.4 Summary3. Experimental Techniques3.1 Test structures3.2 Electrical measurements3.3 Elemental characterizations3.4 Summary4. Al-Dielectric Interfaces4.1 Al-SiO2 interface4.2 Al/low-k dielectric interfaces4.3 Chemical identification of Al-ion drift4.4 SiO2 as a dielectric barrier against Al-ion drift4.5 Summary5. Cu-Dielectric Interfaces5.1 Stability of Cu-SiO2 in an oxygen-free environment5.2 Instability of Cu-SiO2 in an oxygen-containing environment5.3 Origin of Cu ions in SiO25.4 Cu ion diffusivity inside SiO25.5 Cu ions in porous low-k dielectrics5.6 Pre-cleaning of Cu/low-k dielectrics5.7 Cu atoms in porous low-k dielectrics5.8 Dielectrics containing no oxygen5.9 Summary6. Barrier Metal-Dielectric Interfaces6.1 Barrier metals on SiO26.2 Barrier metals on low-k dielectrics7. Self-Forming Barriers7.1 General considerations7.2 Cu(Al) self-forming barrier7.3 Cu(Mg) self-forming barrier 7.4. Cu(Mn) self-forming barrier7.5 Refractory metal self-forming barrier alloys7.6 Summary8. Kinetics of Ion Drift8.1 Ion distribution simulations8.2 Leakage current8.3 C-V characteristics8.4 Summary9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions9.1 Time-dependent dielectric breakdown (TDDB)9.2 Dielectric pore-sealing9.3 Resistance-switching memory9.4 Summary
Series Title: Springer series in materials science, v. 157.
Responsibility: Ming He, Toh-Ming Lu.

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity

<http://www.worldcat.org/oclc/776675131> # Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability
    a schema:Book, schema:CreativeWork ;
   library:oclcnum "776675131" ;
   library:placeOfPublication <http://dbpedia.org/resource/New_York_City> ; # New York
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/nyu> ;
   schema:about <http://experiment.worldcat.org/entity/work/data/1060838926#Topic/microelectronics_materials> ; # Microelectronics--Materials
   schema:about <http://id.worldcat.org/fast/976205> ; # Interfaces (Physical sciences)
   schema:about <http://dewey.info/class/621.381/e23/> ;
   schema:about <http://id.worldcat.org/fast/1019771> ; # Microelectronics--Materials
   schema:bookFormat bgn:PrintBook ;
   schema:contributor <http://viaf.org/viaf/113416746> ; # Toh-Ming Lu
   schema:copyrightYear "2012" ;
   schema:creator <http://experiment.worldcat.org/entity/work/data/1060838926#Person/he_ming> ; # Ming He
   schema:datePublished "2012" ;
   schema:exampleOfWork <http://worldcat.org/entity/work/id/1060838926> ;
   schema:inLanguage "en" ;
   schema:isPartOf <http://worldcat.org/issn/0933-033X> ; # Springer series in materials science,
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/1060838926#Series/springer_series_in_materials_science> ; # Springer series in materials science ;
   schema:name "Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability"@en ;
   schema:productID "776675131" ;
   schema:publication <http://www.worldcat.org/title/-/oclc/776675131#PublicationEvent/new_york_springer_2012> ;
   schema:publisher <http://experiment.worldcat.org/entity/work/data/1060838926#Agent/springer> ; # Springer
   schema:workExample <http://worldcat.org/isbn/9781461418122> ;
   schema:workExample <http://worldcat.org/isbn/9781461418115> ;
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/776675131> ;
    .


Related Entities

<http://dbpedia.org/resource/New_York_City> # New York
    a schema:Place ;
   schema:name "New York" ;
    .

<http://experiment.worldcat.org/entity/work/data/1060838926#Series/springer_series_in_materials_science> # Springer series in materials science ;
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/776675131> ; # Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability
   schema:name "Springer series in materials science ;" ;
    .

<http://id.worldcat.org/fast/1019771> # Microelectronics--Materials
    a schema:Intangible ;
   schema:name "Microelectronics--Materials"@en ;
    .

<http://id.worldcat.org/fast/976205> # Interfaces (Physical sciences)
    a schema:Intangible ;
   schema:name "Interfaces (Physical sciences)"@en ;
    .

<http://viaf.org/viaf/113416746> # Toh-Ming Lu
    a schema:Person ;
   schema:birthDate "1943" ;
   schema:familyName "Lu" ;
   schema:givenName "Toh-Ming" ;
   schema:givenName "T.-M" ;
   schema:name "Toh-Ming Lu" ;
    .

<http://worldcat.org/isbn/9781461418115>
    a schema:ProductModel ;
   schema:isbn "1461418119" ;
   schema:isbn "9781461418115" ;
    .

<http://worldcat.org/isbn/9781461418122>
    a schema:ProductModel ;
   schema:isbn "1461418127" ;
   schema:isbn "9781461418122" ;
    .

<http://worldcat.org/issn/0933-033X> # Springer series in materials science,
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/776675131> ; # Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability
   schema:issn "0933-033X" ;
   schema:name "Springer series in materials science," ;
    .

<http://www.worldcat.org/title/-/oclc/776675131>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
   schema:about <http://www.worldcat.org/oclc/776675131> ; # Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability
   schema:dateModified "2017-10-22" ;
   void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.