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Microcircuit Engineering 89 : proceedings of the International Conference on Microlithography, September 26-28, 1989, Cambridge, England

Author: H Ahmed
Publisher: Amsterdam ; New York : Elsevier ; Tokyo : Ohmsha ; New York, N.Y., U.S.A. : Distributors for the United States and Canada, Elsevier Science Pub. Co., ©1990.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Database:WorldCat
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
Microcircuit Engineering 89 (1989 : Cambridge, England).
Microcircuit Engineering 89.
Amsterdam ; New York : Elsevier ; Tokyo : Ohmsha ; New York, N.Y., U.S.A. : Distributors for the United States and Canada, Elsevier Science Pub. Co., ©1990
(OCoLC)623148018
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: H Ahmed
ISBN: 0444881824 9780444881823
OCLC Number: 23080133
Description: 708 pages : illustrations ; 27 cm
Contents: A selection of contents: Physics of Microstructures. One dimensional ballistic in GaAs microstructures (M. Pepper) (Invited). Magnetoresistance measurements in microstructured InGaAs/InP wires (A. Menschig et al.). Fabrication of quantum wires and dots by selective Ga + implantation enhanced inter-diffusion (C. Vieu et al.). Electronic transport in ballistic structures (R.J. Brown et al.). Preparation of quantum wires and quantum dots by deep mesa etching of AIGaAs-GaAs and InGaAs-InAIAs heterostructures (P. Grambow et al.). Sub-micron Devices. Sub-100 nm electronic devices and quantum-effects research using X-ray nanolithography (H.I. Smith et al.) (Invited). Silicon micromachining for microsensors and microactuators (W. Benecke) (Invited). OMVPE buried ultrafine periodic structures in GaInAs and Inp (T. Yamamoto et. al.). Fabrication of high aspect ratio symmetric and asymmetric T-shaped gates for high frequency pseudomorphic HEMTs (E. Lopez et al.). Electron beam lithography of 100 nm T-gates for GaAs MESFETs (B. Wolfstadter et al.). Optical Lithography. A comparison of projection and proximity printings from UV to X-ray (B.J. Lin). Excimer laser induced damage in fused silica (M. Rothschild et al.). Deep UV optics for excimer laser systems (F.N. Goodall et al.). The impact of thin film interference effects on sub-micron lithography processing (G.D. Maxwell et al.). X-ray Lithography. Helios: A compact synchrotron X-ray source (M.N. Wilson et al.). X-ray lithography at the super-ACO storage ring of Orsay (France) (F. Rousseaux et al.). Infrared measurement of X-ray mask heating during SR-lithography (J. Trube et al.). Procedure and results of mask fabrication via X-ray lithography (J. Grimm et al.). Thermoelastic effects in X-ray lithography masks during synchrotron storage ring irradiation (Y. Vladimirsky et al.). Laser plasma X-ray lithography using novolak resists (M. Chaker et al.). Electron Beam Lithography. Possibilities and limits of high speed e-beam submicron lithography (K.D. van der Mast et al.) (Invited). Design of a non-equisectored 20-electrode deflector for e-beam lithography using a field emission electron beam (E.-R. Weidlich). Online exposure dose correction during electron beam pattern delineation by blanking pulse width modulation (N.K.L. Raja et al.). LaB 6 electron sources with improved lifetime and brightness for Cambridge EBMF systems (C. Dix et al.). Ion Beam Lithography. Microfabrication using focused ion beams (K. Gamo, S. Namba) (Invited). Experimental study of multiple ion beam machine (M. Ando et al.). Low stress silicon stencil masks for sub-100 nm beam lithography (F.-O. Fong et al.). Resists. Priming of silicon substrates with trimethylsilyl containing compounds (M.C.B.A. Michielsen et al.). Silylation of resist materials using di- and polyfunctional organosilicon compounds (E. Babich et al.). Aqueous phase silylation: A new route to plasma developable high resolution resists (R. Sezi et al.). Dry Etching.
Responsibility: edited by H. Ahmed [and others].

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