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Microelectronic packaging and laser processing : 25-26 June 1997, Singapore

Author: Yong-Khim SweeHong Yu ZhengRay T ChenSociety of Photo-optical Instrumentation Engineers.Society of Photo-optical Instrumentation Engineers. Singapore Chapter.All authors
Publisher: Bellingham, Wash. : Society of Photo-optical Instrumentation Engineers, ©1997.
Series: Proceedings of SPIE--the International Society for Optical Engineering, v. 3184.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
Microelectronic packaging and laser processing.
Bellingham, Wash. : SPIE, ©1997
(OCoLC)645882484
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Yong-Khim Swee; Hong Yu Zheng; Ray T Chen; Society of Photo-optical Instrumentation Engineers.; Society of Photo-optical Instrumentation Engineers. Singapore Chapter.; Institute of Physics, Singapore.; Nanyang Technological University.
ISBN: 0819426113 9780819426116
OCLC Number: 37699531
Description: vii, 230 pages : illustrations ; 28 cm.
Contents: MCM and BGA packaging --
Packaging materials and reliability --
Clocks and optical interconnects --
Interconnects : reversible, wafer level, and chip level --
Laser surface treatment --
Laser micromachining --
Laser processes and modeling.
Series Title: Proceedings of SPIE--the International Society for Optical Engineering, v. 3184.
Responsibility: Yong Khim Swee, Hong Yu Zheng, Ray T. Chen, chairs/editors ; sponsored by SPIE--the International Society for Optical Engineering, SPIE Singapore Chapter, Institute of Physics, Singapore ; cosponsored by SPIE Japan Chapter [and others] ; cooperating organizations Nanyang Technological University (Singapore) [and others].

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