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Microelectronic packaging

Author: Madhav Datta; Tetsuya Saka; J W Schultze
Publisher: Boca Raton, FL : CRC Press, ©2005.
Series: New trends in electrochemical technology, v. 3.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:

With the advent of electrochemical processing technologies for chips metallization, there has been corresponding development of equipment compatible with semiconductor industry standards. These  Read more...

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Genre/Form: Electronic books
Additional Physical Format: Print version:
Microelectronic packaging.
Boca Raton, FL : CRC Press, ©2005
(DLC) 2004050337
(OCoLC)55149527
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Madhav Datta; Tetsuya Saka; J W Schultze
ISBN: 041531190X 9780415311908 020347368X 9780203473689
OCLC Number: 62777603
Description: 1 online resource (542 pages) : illustrations.
Contents: Electrochemical processing technologies and their impact in microelectronic packaging / Madhav Datta --
Electroplating process for Cu chip metallization / Valery M. Dubin [and others] --
Electroless barrier and seed layers for on-chip metallization / Valery M. Dubin [and others] --
Alternative materials for ULSI and MEMS metallization / Yosi Shacham-Diamond [and others] --
Tape carrier and development trend / Osamu Yoshioka and Akira Chinda --
Flip-chip interconnection / Madhav Datta --
Compliant interconnects / Paul A. Kohl --
Pb-free flip-chip technologies / Darrel R. Frear and W.H. Lytle --
Materials overview in organic packaging / Saikumar Jayaraman, John Tang, and Vijay S. Wakharkar --
Glass-ceramic packages / Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki Utsumi --
Electrochemical processes in the fabrication of multichip modules / Sol Krongelb [and others] --
Bumping technology for advanced packages / Shinichi Wakabayashi --
Plated through-hole technology for boards / Haruo Akahoshi --
Electroplated contact materials for connectors and relays / Yutaka Okinaka --
Chemical-mechanical planarization : from scratch to planar / David K. Watts, Norio Kimura, and Manabu Tsujimura --
Electrochemical deposition equipment / Tom Ritzdorf and Dakin Fulton --
Processes and equipment for wet etching and cleaning / Jeffery W. Butterbaugh.
Series Title: New trends in electrochemical technology, v. 3.
Responsibility: edited by M. Datta, T. Osaka, J.W. Schultze.
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