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Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore

Author: Cher Ming Tan; Society of Photo-optical Instrumentation Engineers.; Nanyang Technological University.; Institute of Physics, Singapore.
Publisher: Bellingham, Wash., USA : SPIE, ©2000.
Series: Proceedings of SPIE--the International Society for Optical Engineering, v. 4229.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Database:WorldCat
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Genre/Form: Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Cher Ming Tan; Society of Photo-optical Instrumentation Engineers.; Nanyang Technological University.; Institute of Physics, Singapore.
ISBN: 0819439010 9780819439017
OCLC Number: 46342003
Description: xvii, 222 pages : illustrations ; 28 cm.
Series Title: Proceedings of SPIE--the International Society for Optical Engineering, v. 4229.
Responsibility: Cher Ming Tan [and others], chairs/editors ; sponsored by Nanyang Technological University (Singapore) [and] SPIE--the International Society for Optical Engineering ; cooperating organizations, Institute of Physics (Singapore) [and others].

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Primary Entity

<http://www.worldcat.org/oclc/46342003> # Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore
    a schema:Book, schema:CreativeWork ;
   library:oclcnum "46342003" ;
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/wau> ;
   library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/367183772#Place/bellingham_wash_usa> ; # Bellingham, Wash., USA
   schema:about <http://experiment.worldcat.org/entity/work/data/367183772#Topic/microelectromechanical_systems_reliability> ; # Microelectromechanical systems--Reliability
   schema:about <http://id.worldcat.org/fast/1019751> ; # Microelectronic packaging
   schema:about <http://dewey.info/class/621.381/e21/> ;
   schema:bookFormat bgn:PrintBook ;
   schema:contributor <http://viaf.org/viaf/143212124> ; # Nanyang Technological University.
   schema:contributor <http://experiment.worldcat.org/entity/work/data/367183772#Person/tan_cher_ming_1959> ; # Cher Ming Tan
   schema:contributor <http://viaf.org/viaf/140405330> ; # Institute of Physics, Singapore.
   schema:contributor <http://viaf.org/viaf/127619765> ; # Society of Photo-optical Instrumentation Engineers.
   schema:copyrightYear "2000" ;
   schema:datePublished "2000" ;
   schema:exampleOfWork <http://worldcat.org/entity/work/id/367183772> ;
   schema:genre "Conference papers and proceedings"@en ;
   schema:genre "Conference publication"@en ;
   schema:inLanguage "en" ;
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/367183772#Series/spie_proceedings_series> ; # SPIE proceedings series ;
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/367183772#Series/proceedings_of_spie_the_international_society_for_optical_engineering> ; # Proceedings of SPIE--the International Society for Optical Engineering ;
   schema:name "Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore"@en ;
   schema:productID "46342003" ;
   schema:publication <http://www.worldcat.org/title/-/oclc/46342003#PublicationEvent/bellingham_wash_usa_spie_2000> ;
   schema:publisher <http://experiment.worldcat.org/entity/work/data/367183772#Agent/spie> ; # SPIE
   schema:workExample <http://worldcat.org/isbn/9780819439017> ;
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/46342003> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/367183772#Person/tan_cher_ming_1959> # Cher Ming Tan
    a schema:Person ;
   schema:birthDate "1959" ;
   schema:familyName "Tan" ;
   schema:givenName "Cher Ming" ;
   schema:name "Cher Ming Tan" ;
    .

<http://experiment.worldcat.org/entity/work/data/367183772#Place/bellingham_wash_usa> # Bellingham, Wash., USA
    a schema:Place ;
   schema:name "Bellingham, Wash., USA" ;
    .

<http://experiment.worldcat.org/entity/work/data/367183772#Series/proceedings_of_spie_the_international_society_for_optical_engineering> # Proceedings of SPIE--the International Society for Optical Engineering ;
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/46342003> ; # Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore
   schema:name "Proceedings of SPIE--the International Society for Optical Engineering ;" ;
    .

<http://experiment.worldcat.org/entity/work/data/367183772#Series/spie_proceedings_series> # SPIE proceedings series ;
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/46342003> ; # Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore
   schema:name "SPIE proceedings series ;" ;
    .

<http://experiment.worldcat.org/entity/work/data/367183772#Topic/microelectromechanical_systems_reliability> # Microelectromechanical systems--Reliability
    a schema:Intangible ;
   schema:hasPart <http://id.loc.gov/authorities/subjects/sh97007351> ;
   schema:name "Microelectromechanical systems--Reliability"@en ;
    .

<http://id.worldcat.org/fast/1019751> # Microelectronic packaging
    a schema:Intangible ;
   schema:name "Microelectronic packaging"@en ;
    .

<http://viaf.org/viaf/127619765> # Society of Photo-optical Instrumentation Engineers.
    a schema:Organization ;
   schema:name "Society of Photo-optical Instrumentation Engineers." ;
    .

<http://viaf.org/viaf/140405330> # Institute of Physics, Singapore.
    a schema:Organization ;
   schema:name "Institute of Physics, Singapore." ;
    .

<http://viaf.org/viaf/143212124> # Nanyang Technological University.
    a schema:Organization ;
   schema:name "Nanyang Technological University." ;
    .

<http://worldcat.org/isbn/9780819439017>
    a schema:ProductModel ;
   schema:isbn "0819439010" ;
   schema:isbn "9780819439017" ;
    .

<http://www.worldcat.org/title/-/oclc/46342003>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
   schema:about <http://www.worldcat.org/oclc/46342003> ; # Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore
   schema:dateModified "2016-05-11" ;
   void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


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