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Genre/Form: Electronic books
Handbooks, manuals, etc
Additional Physical Format: Print version:
Microelectronics failure analysis.
Materials Park, Ohio : ASM International, ©2004
(OCoLC)57017140
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Electronic Device Failure Analysis Society. Desk Reference Committee.; ASM International.
ISBN: 9781615032662 1615032665
OCLC Number: 297826771
Description: 1 online resource (xiv, 800 pages) : illustrations
Contents: Introduction --
Failure analysis process flow --
Failure verification --
Failure mode: failure classifications --
Special devices --
Non-destructive analysis techniques --
Depackaging --
Photon emission (electroluminescence) localization techniques --
Microthermography --
Laser and particle beam-based localization techniques --
Deprocessing --
General imaging techniques --
Local deprocessing and imaging --
Materials analysis techniques --
Important topics for semiconductor devices --
FA techniques/tools roadmaps --
FA operation and management --
Appendix.
Responsibility: edited by the Electronic Device Failure Analysis Society, Desk Reference Committee.

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