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Micromachining and micropackaging of transducers

Author: Clifford D Fung
Publisher: Amsterdam ; New York : Elsevier ; New York, N.Y. : [distributor] for the U.S.A. and Canada : Elsevier Science Pub. Co., 1985.
Series: Studies in electrical and electronic engineering, 20.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Clifford D Fung
ISBN: 0444425608 9780444425607 0444417133 9780444417138
OCLC Number: 12669388
Notes: Papers from the Workshop on Micromachining and Micropackaging of Transducers, organized by the faculty associated with the Semiconductor Chemical Transducer Resource at Case Western Reserve University, on Nov. 7-9, 1984.
Description: viii, 244 pages : illustrations ; 25 cm.
Contents: I. Overview. Silicon micromachining and its application to high performance integrated sensors (K.D. Wise). Epoxy encapsulants, adhesives and specialty polymers for microelectronic applications (D.R. Owen, R.M. Zone). II. Micropackaging and Encapsulation. Packaging considerations for the microdielectrometer and related chemical sensors (S.D. Senturia, D.R. Day). Bonding techniques for microsensors (W.H. Ko et al.). Corrosion protection for implantable integrated sensors by CO 2 laser processing for glass and silicon (Y. Naruse et al.). Electrical contacts to implantable integrated sensors by CO 2 laser-drilled bias through glass (L. Bowman et al.). Packaging of an intracranial pressure telemetering unit for chronic implantation (T. Spear et al.). III. Etching Techniques. Orientations of the third kind: the coming of age of (110) silicon (D.L. Kendall,G.R. de Guel). The use of a certain fluorocarbon surfactant and fluorocarbon conformal coating improves KOH silicon etching quality (B. Block, M. Sierakowsky). Ellipsometric study of bias-dependent etching and the etch-stop mechanism for silicon in aqueous KOH (E.D. Palik et al.). Submicron accuracies in anisotropic etched silicon piece parts - a case study (T.L. Poteat). Deep etching of silicon using plasma (C.D. Fung, J.R. Linkowski). IV. Microstructures. Microfabrication technology for microsensors (L.T. Romankiw). Polycrystalline silicon microstructures (R.T. Howe). Micromachining technology for flexible sensor arrays (P.W. Barth). Planar processed, integrated displacement sensors (H. Guckel et al.). Electrochemical shaping of three dimensional continuously modulated surface contours (U. Langau et al.). V. Applications. A microtransducer for air flow and differential pressure sensing applications (G.B. Hocker et al.). V-groove capillary for low flow control and measurement (M.G. Guvenc). Fabrication of biomedical sensors using thin and thick film microelectronic technology (M.R. Neuman, C.-C. Liu). Microelectronic microelectrode glucose sensor at low potentials (L.-T. Chan et al.). Potential applications of micromachining to semiconductor chemical sensors (P.W. Cheung).
Series Title: Studies in electrical and electronic engineering, 20.
Responsibility: [edited by] Clifford D. Fung [and others].

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