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Microsensors, MEMS, and smart devices

Author: J W Gardner; V K Varadan; Osama O Awadelkarim
Publisher: Chichester ; New York : J. Wiley, ©2001.
Edition/Format:   Print book : EnglishView all editions and formats
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Additional Physical Format: Online version:
Gardner, J.W. (Julian W.), 1958-
Microsensors, MEMS, and smart devices.
Chichester ; New York : J. Wiley, ©2001
(OCoLC)606613284
Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: J W Gardner; V K Varadan; Osama O Awadelkarim
ISBN: 047186109X 9780471861096
OCLC Number: 46538604
Description: xvi, 503 pages : illustrations ; 25 cm
Contents: Historical Development of Microelectronics --
Evolution of Microsensors --
Evolution of MEMS --
Emergence of Micromachines --
Electronic Materials and Processing --
Electronic Materials and their Deposition --
Oxide Film Formation by Thermal Oxidation --
Deposition of Silicon Dioxide and Silicon Nitride --
Polysilicon Film Deposition --
Pattern Transfer --
The Lithographic Process --
Mask Formation --
Resist --
Lift-off Technique --
Etching Electronic Materials --
Wet Chemical Etching --
Dry Etching --
Doping Semiconductors --
Diffusion --
Ion Implantation --
MEMS Materials and their Preparation --
Atomic Structure and the Periodic Table --
Atomic Bonding --
Crystallinity --
Metals --
Physical and Chemical Properties --
Metallisation --
Semiconductors --
Semiconductors: Electrical and Chemical Properties --
Semiconductors: Growth and Deposition --
Ceramic, Polymeric, and Composite Materials --
Standard Microelectronic Technologies --
Wafer Preparation --
Crystal Growth --
Wafer Manufacture --
Epitaxial Deposition --
Monolithic Processing --
Bipolar Processing --
Characteristics of BJTs --
MOS Processing --
Characteristics of FETs --
SOI CMOS Processing --
Monolithic Mounting --
Die Bonding and Wire Bonding --
Tape-Automated Bonding --
Flip TAB Bonding --
Flip-Chip Mounting --
Printed Circuit Board Technologies --
Solid Board --
Flexible Board --
Plastic Moulded --
Hybrid and MCM Technologies --
Thick Film --
Multichip Modules --
Ball Grid Array --
Programmable Devices And ASICs --
Silicon Micromachining: Bulk.
Responsibility: Julian W. Gardner, Vijay K. Varadan, Osama O. Awadelkarim.
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