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Microvias : for low-cost, high-density interconnects

Author: John H Lau; S W Ricky Lee
Publisher: New York : McGraw-Hill, ©2001.
Series: McGraw-Hill professional engineering.
Edition/Format:   Print book : EnglishView all editions and formats
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Additional Physical Format: Online version:
Lau, John H.
Microvias.
New York : McGraw-Hill, ©2001
(OCoLC)606546664
Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: John H Lau; S W Ricky Lee
ISBN: 0071363270 9780071363273
OCLC Number: 46671171
Description: xxiii, 565 pages : illustrations ; 24 cm.
Contents: Ch. 1. Introduction to Microvia and WLCSP Technologies --
Ch. 2. Conventional Printed Circuit Board Technologies --
Ch. 3. Microvias by Mechanical Drilling --
Ch. 4. Microvias by Laser Drilling --
Ch. 5. Microvias by Photoimaging --
Ch. 6. Microvias by Etching --
Ch. 7. Conductive Paste/Ink-filled Microvias --
Ch. 8. Special High-Density Interconnects for Flip Chip Applications --
Ch. 9. Solders for Next-Generation High-Density Interconnects --
Ch. 10. Solder-Bumped Flip-Chip WLCSP --
Ch. 11. Assembly of Flip Chip on PCB/Substrate --
Ch. 12. Solder Joint Reliability of Flip Chip on Microvia PCB/Substrates.
Series Title: McGraw-Hill professional engineering.
Responsibility: John H. Lau, S.W. Ricky Lee.
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Abstract:

A guide to microvias technology. It covers technology basics, design methods, heat concerns and developments, and surveys companies and products. Microvias products are essential to small mobile  Read more...

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