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Microwave and millimeter-wave electronic packaging

Author: Rick Sturdivant
Publisher: Boston : Artech House, [2014] ©2014
Series: Artech House microwave library.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer;  Read more...

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Document Type: Book
All Authors / Contributors: Rick Sturdivant
ISBN: 9781608076970 1608076970
OCLC Number: 868082231
Description: xvii, 261 pages : illustrations ; 24 cm.
Contents: Introduction --
Materials --
Ceramic packaging --
Laminate packaging --
First-level interconnects --
Second-level interconnects --
Modules and motherboards --
Transitions and 3D packaging --
Heat transfer --
Electromagnetic modeling --
Conclusions and future horizons.
Series Title: Artech House microwave library.
Responsibility: Rick Sturdivant.

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