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Multichip module technologies and alternatives : the basics

Author: Daryl Ann Doane; Paul D Franzon
Publisher: New York : Van Nostrand Reinhold, ©1993.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and  Read more...

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Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: Daryl Ann Doane; Paul D Franzon
ISBN: 0442012365 9780442012366
OCLC Number: 26541374
Description: xxxii, 875 pages : illustrations ; 24 cm
Contents: Forward. Preface. Acknowledgements. Introduction. Part A: The framework. MCM package selection: a materials and manufacturing perspective. MCM package selection: a systems need perspective. MCM package selection: cost issues. Part B: The basics. Laminate-based technologies for multichip modules. Thick film and ceramic technologies for hybrid multichip modules. Thin film multilayer interconnection technologies for multichip modules. Selection criteria for multichip module dielectrics. Chip-to-substrate (first level) connection technology options. MCM-to-printed wiring board (second level) connection technology options. Electrical design of digital multichip modules. Thermal design considerations for multichip module applications. Electrical testing of multichip modules. Part C: Case studies. The development of Unisys multichip modules. High performance aerospace multichip module technology development at Hughes. Silicon-based multichip modules. The technology and manufacture of the VAX-9000 multichip unit. Part D: Closing the loop. Complementing technologies for MCM success. Epilogue. Index.
Responsibility: edited by Daryl Ann Doane, Paul D. Franzon.
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Primary Entity

<http://www.worldcat.org/oclc/26541374> # Multichip module technologies and alternatives : the basics
    a schema:Book, schema:CreativeWork ;
    library:oclcnum "26541374" ;
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/nyu> ;
    library:placeOfPublication <http://dbpedia.org/resource/New_York_City> ; # New York
    schema:about <http://id.worldcat.org/fast/1019751> ; # Microelectronic packaging
    schema:about <http://experiment.worldcat.org/entity/work/data/29268948#Topic/circuitos_integrados> ; # Circuitos integrados
    schema:about <http://dewey.info/class/621.395/e20/> ;
    schema:about <http://id.worldcat.org/fast/975610> ; # Integrated circuits--Very large scale integration--Design and construction
    schema:about <http://id.loc.gov/authorities/subjects/sh2008104742> ; # Integrated circuits--Very large scale integration--Design and construction
    schema:bookFormat bgn:PrintBook ;
    schema:contributor <http://viaf.org/viaf/161819522> ; # Paul D. Franzon
    schema:contributor <http://viaf.org/viaf/278801505> ; # Daryl Ann Doane
    schema:copyrightYear "1993" ;
    schema:datePublished "1993" ;
    schema:exampleOfWork <http://worldcat.org/entity/work/id/29268948> ;
    schema:inLanguage "en" ;
    schema:name "Multichip module technologies and alternatives : the basics"@en ;
    schema:productID "26541374" ;
    schema:publication <http://www.worldcat.org/title/-/oclc/26541374#PublicationEvent/new_york_van_nostrand_reinhold_1993> ;
    schema:publisher <http://experiment.worldcat.org/entity/work/data/29268948#Agent/van_nostrand_reinhold> ; # Van Nostrand Reinhold
    schema:url <http://catdir.loc.gov/catdir/enhancements/fy0820/92029779-t.html> ;
    schema:url <http://www.gbv.de/dms/bowker/toc/9780442012366.pdf> ;
    schema:workExample <http://worldcat.org/isbn/9780442012366> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/26541374> ;
    .


Related Entities

<http://dbpedia.org/resource/New_York_City> # New York
    a schema:Place ;
    schema:name "New York" ;
    .

<http://experiment.worldcat.org/entity/work/data/29268948#Agent/van_nostrand_reinhold> # Van Nostrand Reinhold
    a bgn:Agent ;
    schema:name "Van Nostrand Reinhold" ;
    .

<http://experiment.worldcat.org/entity/work/data/29268948#Topic/circuitos_integrados> # Circuitos integrados
    a schema:Intangible ;
    schema:name "Circuitos integrados"@en ;
    .

<http://id.loc.gov/authorities/subjects/sh2008104742> # Integrated circuits--Very large scale integration--Design and construction
    a schema:Intangible ;
    schema:name "Integrated circuits--Very large scale integration--Design and construction"@en ;
    .

<http://id.worldcat.org/fast/1019751> # Microelectronic packaging
    a schema:Intangible ;
    schema:name "Microelectronic packaging"@en ;
    .

<http://id.worldcat.org/fast/975610> # Integrated circuits--Very large scale integration--Design and construction
    a schema:Intangible ;
    schema:name "Integrated circuits--Very large scale integration--Design and construction"@en ;
    .

<http://viaf.org/viaf/161819522> # Paul D. Franzon
    a schema:Person ;
    schema:familyName "Franzon" ;
    schema:givenName "Paul D." ;
    schema:name "Paul D. Franzon" ;
    .

<http://viaf.org/viaf/278801505> # Daryl Ann Doane
    a schema:Person ;
    schema:familyName "Doane" ;
    schema:givenName "Daryl Ann" ;
    schema:name "Daryl Ann Doane" ;
    .

<http://worldcat.org/isbn/9780442012366>
    a schema:ProductModel ;
    schema:isbn "0442012365" ;
    schema:isbn "9780442012366" ;
    .


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