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Nanopackaging : nanotechnologies and electronics packaging

Author: James E Morris
Publisher: New York : Springer, ©2008.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks,"  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Nanopackaging.
New York : Springer, ©2008
(DLC) 2007932733
(OCoLC)154711827
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: James E Morris
ISBN: 9780387473260 0387473262 9780387473253 0387473254
OCLC Number: 405547106
Description: 1 online resource (xxi, 543 pages) : illustrations
Contents: Nanopackaging: Nanotechnologies and Electronics Packaging --
Modelling Technologies and Applications --
Application of Molecular Dynamics Simulation in Electronic Packaging --
Advances in Delamination Modeling --
Nanoparticle Properties --
Nanoparticle Fabrication --
Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges --
Nanostructured Resistor Materials --
Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging --
Nanoconductive Adhesives --
Nanoparticles in Microvias --
Materials and Technology for Conductive Microstructures --
A Study of Nanoparticles in SnAg-Based Lead-Free Solders --
Nano-Underfills for Fine-Pitch Electronics --
Carbon Nanotubes: Synthesis and Characterization --
Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications --
Carbon Nanotubes for Thermal Management of Microsystems --
Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes --
Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes --
Nanowires in Electronics Packaging --
Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging --
Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities --
Nanoelectronics Landscape: Application, Technology, and Economy --
Errata.
Responsibility: edited by James E. Morris.

Abstract:

This book presents a comprehensive overview of nanoscale electronics and systems packaging, covering nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a  Read more...

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From the reviews:"This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for Read more...

 
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