skip to content
Optoelectronic packaging : 1-2 February 1996, San Jose, California Preview this item
ClosePreview this item
Checking...

Optoelectronic packaging : 1-2 February 1996, San Jose, California

Author: Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
Publisher: Bellingham, Wash. : Society of Photo-optical Instrumentation Engineers, ©1996.
Series: Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
Edition/Format:   Book : Conference publication : EnglishView all editions and formats
Database:WorldCat
Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

 

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Genre/Form: Conference proceedings
Congresses
Additional Physical Format: Online version:
Optoelectronic packaging.
Bellingham, Wash. : SPIE, c1996
(OCoLC)605126696
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
ISBN: 0819420654 9780819420657
OCLC Number: 34705756
Description: v, 196 p. : ill. ; 28 cm.
Contents: Guided wave interconnects: Recent developments in polymer waveguide technology and applications for data link and optical interconnect systems / B. L. Booth. Three-dimensional packaging of very large scale integrated optics (VLSIO) for high-complexity optical systems / L. C. West, C. W. Roberts, E. C. Piscani, M. Dubey, K. A. Jones and G. F. McLane. MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging / J. P. Bristow, Y. Liu, T. Marta, K. Johnson, B. R. Hanzal, A. Peczalski, S. Bounnak, Y. S. Liu and H. S. Cole. Coupling of VCSEL array into multimode polymer waveguides / J. K. Rowlette, Sr., M. K. Kallen, W. H. Lewis, J. D. Stack, T. M. Ward, C. Mueller and A. Plotts --
Advanced packaging and alignment methods --
Packaging for optical switching applications --
Reliability and thermal issues.
Series Title: Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
Responsibility: Michael R. Feldman, Yung-Cheng Lee, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organization, ARPA, Advanced Research Projects Agency.

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


<http://www.worldcat.org/oclc/34705756>
library:oclcnum"34705756"
library:placeOfPublication
library:placeOfPublication
owl:sameAs<info:oclcnum/34705756>
rdf:typeschema:Book
schema:about
schema:about
schema:about
schema:about
schema:about
schema:about
<http://id.worldcat.org/fast/1046910>
rdf:typeschema:Intangible
schema:name"Microelectronic packaging."@en
schema:name"Optoelectronic devices--Design and construction"@en
schema:about
schema:about
schema:about
schema:contributor
<http://viaf.org/viaf/151856603>
rdf:typeschema:Organization
schema:name"Society of Photo-optical Instrumentation Engineers."
schema:contributor
<http://viaf.org/viaf/154230733>
rdf:typeschema:Organization
schema:name"United States. Advanced Research Projects Agency."
schema:contributor
schema:contributor
schema:copyrightYear"1996"
schema:datePublished"1996"
schema:exampleOfWork<http://worldcat.org/entity/work/id/787294981>
schema:genre"Conference proceedings."@en
schema:genre"Conference proceedings"@en
schema:inLanguage"en"
schema:name"Optoelectronic packaging : 1-2 February 1996, San Jose, California"@en
schema:numberOfPages"196"
schema:publisher
schema:url
schema:workExample

Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.