aller au contenu
Optoelectronic packaging : 1-2 February 1996, San Jose, California Aperçu de cet ouvrage
FermerAperçu de cet ouvrage
Vérification...

Optoelectronic packaging : 1-2 February 1996, San Jose, California

Auteur : Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
Éditeur : Bellingham, Wash. : SPIE, ©1996.
Collection : Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
Édition/format :   Livre imprimé : Conference publication : EnglishVoir toutes les éditions et tous les formats
Base de données :WorldCat
Évaluation :

(pas encore évalué) 0 avec des critiques - Soyez le premier.

Sujets
Plus comme ceci

 

Trouver un exemplaire dans la bibliothèque

&AllPage.SpinnerRetrieving; Recherche de bibliothèques qui possèdent cet ouvrage...

Détails

Genre/forme : Conference papers and proceedings
Congresses
Format – détails additionnels : Online version:
Optoelectronic packaging.
Bellingham, Wash. : SPIE, ©1996
(OCoLC)605126696
Type d’ouvrage : Conference publication
Format : Book
Tous les auteurs / collaborateurs : Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
ISBN : 0819420654 9780819420657
Numéro OCLC : 34705756
Description : v, 196 pages : illustrations ; 28 cm.
Contenu : Guided wave interconnects: Recent developments in polymer waveguide technology and applications for data link and optical interconnect systems / B.L. Booth. Three-dimensional packaging of very large scale integrated optics (VLSIO) for high-complexity optical systems / L.C. West, C.W. Roberts, E.C. Piscani, M. Dubey, K.A. Jones and G.F. McLane. MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging / J.P. Bristow, Y. Liu, T. Marta, K. Johnson, B.R. Hanzal, A. Peczalski, S. Bounnak, Y.S. Liu and H.S. Cole. Coupling of VCSEL array into multimode polymer waveguides / J.K. Rowlette, Sr., M.K. Kallen, W.H. Lewis, J.D. Stack, T.M. Ward, C. Mueller and A. Plotts --
Advanced packaging and alignment methods --
Packaging for optical switching applications --
Reliability and thermal issues.
Titre de collection : Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
Responsabilité : Michael R. Feldman, Yung-Cheng Lee, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organization, ARPA, Advanced Research Projects Agency.

Critiques

Critiques d’utilisateurs
Récupération des critiques de GoodReads...
Récuperation des critiques DOGObooks…

Étiquettes

Soyez le premier.
Confirmez cette demande

Vous avez peut-être déjà demandé cet ouvrage. Veuillez sélectionner OK si vous voulez poursuivre avec cette demande quand même.

Données liées


Primary Entity

<http://www.worldcat.org/oclc/34705756> # Optoelectronic packaging : 1-2 February 1996, San Jose, California
    a schema:Book, schema:CreativeWork ;
   library:oclcnum "34705756" ;
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/wau> ;
   library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/787294981#Place/bellingham_wash> ; # Bellingham, Wash.
   schema:about <http://experiment.worldcat.org/entity/work/data/787294981#Topic/integrated_optics> ; # Integrated optics
   schema:about <http://id.worldcat.org/fast/975646> ; # Integrated optics
   schema:about <http://experiment.worldcat.org/entity/work/data/787294981#Topic/optoelectronic_devices_design_and_construction> ; # Optoelectronic devices--Design and construction
   schema:about <http://id.worldcat.org/fast/1019751> ; # Microelectronic packaging
   schema:about <http://experiment.worldcat.org/entity/work/data/787294981#Topic/microelectronic_packaging> ; # Microelectronic packaging
   schema:about <http://id.worldcat.org/fast/1046910> ; # Optoelectronic devices--Design and construction
   schema:about <http://dewey.info/class/621.381045/e21/> ;
   schema:bookFormat bgn:PrintBook ;
   schema:contributor <http://viaf.org/viaf/154230733> ; # United States. Advanced Research Projects Agency.
   schema:contributor <http://viaf.org/viaf/34605519> ; # Yung-Cheng Lee
   schema:contributor <http://viaf.org/viaf/19576897> ; # Michael R. Feldman
   schema:contributor <http://viaf.org/viaf/151856603> ; # Society of Photo-optical Instrumentation Engineers.
   schema:copyrightYear "1996" ;
   schema:datePublished "1996" ;
   schema:exampleOfWork <http://worldcat.org/entity/work/id/787294981> ;
   schema:genre "Conference publication"@en ;
   schema:genre "Conference papers and proceedings"@en ;
   schema:inLanguage "en" ;
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/787294981#Series/proceedings_spie_the_international_society_for_optical_engineering> ; # Proceedings / SPIE--the International Society for Optical Engineering ;
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/787294981#Series/proceedings_of_spie_the_international_society_for_optical_engineering> ; # Proceedings of SPIE--the International Society for Optical Engineering ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/605126696> ;
   schema:name "Optoelectronic packaging : 1-2 February 1996, San Jose, California"@en ;
   schema:productID "34705756" ;
   schema:publication <http://www.worldcat.org/title/-/oclc/34705756#PublicationEvent/bellingham_wash_spie_1996> ;
   schema:publisher <http://experiment.worldcat.org/entity/work/data/787294981#Agent/spie> ; # SPIE
   schema:workExample <http://worldcat.org/isbn/9780819420657> ;
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/34705756> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/787294981#Place/bellingham_wash> # Bellingham, Wash.
    a schema:Place ;
   schema:name "Bellingham, Wash." ;
    .

<http://experiment.worldcat.org/entity/work/data/787294981#Series/proceedings_of_spie_the_international_society_for_optical_engineering> # Proceedings of SPIE--the International Society for Optical Engineering ;
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/34705756> ; # Optoelectronic packaging : 1-2 February 1996, San Jose, California
   schema:name "Proceedings of SPIE--the International Society for Optical Engineering ;" ;
    .

<http://experiment.worldcat.org/entity/work/data/787294981#Series/proceedings_spie_the_international_society_for_optical_engineering> # Proceedings / SPIE--the International Society for Optical Engineering ;
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/34705756> ; # Optoelectronic packaging : 1-2 February 1996, San Jose, California
   schema:name "Proceedings / SPIE--the International Society for Optical Engineering ;" ;
    .

<http://experiment.worldcat.org/entity/work/data/787294981#Topic/optoelectronic_devices_design_and_construction> # Optoelectronic devices--Design and construction
    a schema:Intangible ;
   rdfs:seeAlso <http://id.loc.gov/authorities/subjects/sh2008108685> ;
   schema:name "Optoelectronic devices--Design and construction"@en ;
    .

<http://id.worldcat.org/fast/1019751> # Microelectronic packaging
    a schema:Intangible ;
   schema:name "Microelectronic packaging"@en ;
    .

<http://id.worldcat.org/fast/1046910> # Optoelectronic devices--Design and construction
    a schema:Intangible ;
   schema:name "Optoelectronic devices--Design and construction"@en ;
    .

<http://id.worldcat.org/fast/975646> # Integrated optics
    a schema:Intangible ;
   schema:name "Integrated optics"@en ;
    .

<http://viaf.org/viaf/151856603> # Society of Photo-optical Instrumentation Engineers.
    a schema:Organization ;
   schema:name "Society of Photo-optical Instrumentation Engineers." ;
    .

<http://viaf.org/viaf/154230733> # United States. Advanced Research Projects Agency.
    a schema:Organization ;
   schema:name "United States. Advanced Research Projects Agency." ;
    .

<http://viaf.org/viaf/19576897> # Michael R. Feldman
    a schema:Person ;
   schema:familyName "Feldman" ;
   schema:givenName "Michael R." ;
   schema:name "Michael R. Feldman" ;
    .

<http://viaf.org/viaf/34605519> # Yung-Cheng Lee
    a schema:Person ;
   schema:familyName "Lee" ;
   schema:givenName "Yung-Cheng" ;
   schema:name "Yung-Cheng Lee" ;
    .

<http://worldcat.org/isbn/9780819420657>
    a schema:ProductModel ;
   schema:isbn "0819420654" ;
   schema:isbn "9780819420657" ;
    .

<http://www.worldcat.org/oclc/605126696>
    a schema:CreativeWork ;
   rdfs:label "Optoelectronic packaging." ;
   schema:description "Online version:" ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/34705756> ; # Optoelectronic packaging : 1-2 February 1996, San Jose, California
    .


Content-negotiable representations

Fermer la fenêtre

Veuillez vous identifier dans WorldCat 

Dont have an account? You can easily créez un compte gratuit.