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Optoelectronic packaging : 1-2 February 1996, San Jose, California

著者: Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
出版社: Bellingham, Wash. : SPIE, ©1996.
シリーズ: Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
エディション/フォーマット:   紙書籍 : Conference publication : Englishすべてのエディションとフォーマットを見る
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ジャンル/形式: Conference papers and proceedings
Congresses
その他のフォーマット: Online version:
Optoelectronic packaging.
Bellingham, Wash. : SPIE, ©1996
(OCoLC)605126696
資料の種類: Conference publication, インターネット資料
ドキュメントの種類 書籍, インターネット資料
すべての著者/寄与者: Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
ISBN: 0819420654 9780819420657
OCLC No.: 34705756
物理形態: v, 196 pages : illustrations ; 28 cm.
コンテンツ: Guided wave interconnects: Recent developments in polymer waveguide technology and applications for data link and optical interconnect systems / B.L. Booth. Three-dimensional packaging of very large scale integrated optics (VLSIO) for high-complexity optical systems / L.C. West, C.W. Roberts, E.C. Piscani, M. Dubey, K.A. Jones and G.F. McLane. MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging / J.P. Bristow, Y. Liu, T. Marta, K. Johnson, B.R. Hanzal, A. Peczalski, S. Bounnak, Y.S. Liu and H.S. Cole. Coupling of VCSEL array into multimode polymer waveguides / J.K. Rowlette, Sr., M.K. Kallen, W.H. Lewis, J.D. Stack, T.M. Ward, C. Mueller and A. Plotts --
Advanced packaging and alignment methods --
Packaging for optical switching applications --
Reliability and thermal issues.
シリーズタイトル: Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
責任者: Michael R. Feldman, Yung-Cheng Lee, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organization, ARPA, Advanced Research Projects Agency.

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Primary Entity

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    library:oclcnum "34705756" ;
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    library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/787294981#Place/bellingham_wash> ; # Bellingham, Wash.
    schema:about <http://experiment.worldcat.org/entity/work/data/787294981#Topic/integrated_optics> ; # Integrated optics
    schema:about <http://id.worldcat.org/fast/975646> ; # Integrated optics
    schema:about <http://experiment.worldcat.org/entity/work/data/787294981#Topic/optoelectronic_devices_design_and_construction> ; # Optoelectronic devices--Design and construction
    schema:about <http://id.worldcat.org/fast/1019751> ; # Microelectronic packaging
    schema:about <http://experiment.worldcat.org/entity/work/data/787294981#Topic/microelectronic_packaging> ; # Microelectronic packaging
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    schema:contributor <http://viaf.org/viaf/154230733> ; # United States. Advanced Research Projects Agency.
    schema:contributor <http://viaf.org/viaf/34605519> ; # Yung-Cheng Lee
    schema:contributor <http://viaf.org/viaf/19576897> ; # Michael R. Feldman
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