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Optoelectronic packaging : 1-2 February 1996, San Jose, California

著者: Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
出版商: Bellingham, Wash. : Society of Photo-optical Instrumentation Engineers, ©1996.
丛书: Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
版本/格式:   图书 : 会议刊物 : 英语查看所有的版本和格式
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类型/形式: Conference proceedings
Congresses
附加的形体格式: Online version:
Optoelectronic packaging.
Bellingham, Wash. : SPIE, c1996
(OCoLC)605126696
材料类型: 会议刊物
文件类型:
所有的著者/提供者: Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
ISBN: 0819420654 9780819420657
OCLC号码: 34705756
描述: v, 196 p. : ill. ; 28 cm.
内容: Guided wave interconnects: Recent developments in polymer waveguide technology and applications for data link and optical interconnect systems / B. L. Booth. Three-dimensional packaging of very large scale integrated optics (VLSIO) for high-complexity optical systems / L. C. West, C. W. Roberts, E. C. Piscani, M. Dubey, K. A. Jones and G. F. McLane. MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging / J. P. Bristow, Y. Liu, T. Marta, K. Johnson, B. R. Hanzal, A. Peczalski, S. Bounnak, Y. S. Liu and H. S. Cole. Coupling of VCSEL array into multimode polymer waveguides / J. K. Rowlette, Sr., M. K. Kallen, W. H. Lewis, J. D. Stack, T. M. Ward, C. Mueller and A. Plotts --
Advanced packaging and alignment methods --
Packaging for optical switching applications --
Reliability and thermal issues.
丛书名: Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
责任: Michael R. Feldman, Yung-Cheng Lee, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organization, ARPA, Advanced Research Projects Agency.

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