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Optoelectronic packaging : 1-2 February 1996, San Jose, California

作者: Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
出版商: Bellingham, Wash. : Society of Photo-optical Instrumentation Engineers, ©1996.
叢書: Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
版本/格式:   圖書 : 會議刊物 : 英語所有版本和格式的總覽
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類型/形式: Conference proceedings
Congresses
其他的實體格式: Online version:
Optoelectronic packaging.
Bellingham, Wash. : SPIE, ©1996
(OCoLC)605126696
資料類型: 會議刊物
文件類型: 圖書
所有的作者/貢獻者: Michael R Feldman; Yung-Cheng Lee; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
ISBN: 0819420654 9780819420657
OCLC系統控制編碼: 34705756
描述: v, 196 pages : illustrations ; 28 cm.
内容: Guided wave interconnects: Recent developments in polymer waveguide technology and applications for data link and optical interconnect systems / B.L. Booth. Three-dimensional packaging of very large scale integrated optics (VLSIO) for high-complexity optical systems / L.C. West, C.W. Roberts, E.C. Piscani, M. Dubey, K.A. Jones and G.F. McLane. MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging / J.P. Bristow, Y. Liu, T. Marta, K. Johnson, B.R. Hanzal, A. Peczalski, S. Bounnak, Y.S. Liu and H.S. Cole. Coupling of VCSEL array into multimode polymer waveguides / J.K. Rowlette, Sr., M.K. Kallen, W.H. Lewis, J.D. Stack, T.M. Ward, C. Mueller and A. Plotts --
Advanced packaging and alignment methods --
Packaging for optical switching applications --
Reliability and thermal issues.
叢書名: Proceedings of SPIE--the International Society for Optical Engineering, v. 2691.
責任: Michael R. Feldman, Yung-Cheng Lee, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organization, ARPA, Advanced Research Projects Agency.

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