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Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA

Author: Randy A Heyler; Ray T Chen; Society of Photo-optical Instrumentation Engineers.
Publisher: Bellingham, Wash., USA : SPIE, ©2004.
Series: Proceedings of SPIE--the International Society for Optical Engineering, v. 5358.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Proceedings of SPIE offer access to the latest innovations in research and technology and are among the most cited references in patent literature.

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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Randy A Heyler; Ray T Chen; Society of Photo-optical Instrumentation Engineers.
ISBN: 0819452661 9780819452665
OCLC Number: 55872492
Notes: Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration.
Description: vii, 168 pages : illustrations ; 28 cm.
Series Title: Proceedings of SPIE--the International Society for Optical Engineering, v. 5358.
Other Titles: Photonics packaging and integration 4
Photonics packaging and integration four
Optoelectronic interconnects.
Responsibility: Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.

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