skip to content
Physical design for multichip modules Preview this item
ClosePreview this item
Checking...

Physical design for multichip modules

Author: M Sriram; Sung-Mo Kang
Publisher: Boston : Kluwer Academic Publishers, ©1994.
Series: Kluwer international series in engineering and computer science, SECS 267.
Edition/Format:   Print book : EnglishView all editions and formats
Database:WorldCat
Summary:

Presents research work that has been conducted in the area of Multichip Module (MCM) design. This book presents an overview of the different MCM technologies. It discusses the various approaches to  Read more...

Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

 

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Additional Physical Format: Online version:
Sriram, M. (Mysore), 1966-
Physical design for multichip modules.
Boston : Kluwer Academic Publishers, ©1994
(OCoLC)624399093
Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: M Sriram; Sung-Mo Kang
ISBN: 079239450X 9780792394501
OCLC Number: 29754086
Description: xi, 197 pages : illustrations ; 25 cm.
Contents: Preface. 1. Introduction. 2. Analysis and Modeling of MCM Interconnects. 3. System Partitioning and Chip Placement. 4. Multilayer MCM Routing. 5. Performance-Oriented Tree Construction. 6. Layer Assignment Approaches. 7. Conclusions. References. Index.
Series Title: Kluwer international series in engineering and computer science, SECS 267.
Responsibility: by M. Sriram, S.M. Kang.
More information:

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity

<http://www.worldcat.org/oclc/29754086> # Physical design for multichip modules
    a schema:Book, schema:CreativeWork ;
   library:oclcnum "29754086" ;
   library:placeOfPublication <http://dbpedia.org/resource/Boston> ; # Boston
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/mau> ;
   schema:about <http://experiment.worldcat.org/entity/work/data/31718382#Topic/electronic_packaging_design> ; # Electronic packaging--Design
   schema:about <http://id.worldcat.org/fast/1028809> ; # Multichip modules (Microelectronics)--Design and construction
   schema:about <http://id.worldcat.org/fast/907417> ; # Electronic packaging--Design
   schema:about <http://experiment.worldcat.org/entity/work/data/31718382#Thing/electronic_equipment> ; # Electronic equipment
   schema:about <http://experiment.worldcat.org/entity/work/data/31718382#Topic/structures_multi_puces_micro_electronique> ; # Structures multi-puces (micro ́electronique)
   schema:about <http://dewey.info/class/621.381046/e20/> ;
   schema:about <http://experiment.worldcat.org/entity/work/data/31718382#Topic/multichip_modules_microelectronics_design_and_construction> ; # Multichip modules (Microelectronics)--Design and construction
   schema:bookFormat bgn:PrintBook ;
   schema:contributor <http://viaf.org/viaf/5032414> ; # Sung-Mo Kang
   schema:copyrightYear "1994" ;
   schema:creator <http://viaf.org/viaf/13992960> ; # Mysore Sriram
   schema:datePublished "1994" ;
   schema:exampleOfWork <http://worldcat.org/entity/work/id/31718382> ;
   schema:inLanguage "en" ;
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/31718382#Series/the_kluwer_international_series_in_engineering_and_computer_science> ; # The Kluwer international series in engineering and computer science ;
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/31718382#Series/kluwer_international_series_in_engineering_and_computer_science> ; # Kluwer international series in engineering and computer science ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/624399093> ;
   schema:name "Physical design for multichip modules"@en ;
   schema:productID "29754086" ;
   schema:publication <http://www.worldcat.org/title/-/oclc/29754086#PublicationEvent/boston_kluwer_academic_publishers_1994> ;
   schema:publisher <http://experiment.worldcat.org/entity/work/data/31718382#Agent/kluwer_academic_publishers> ; # Kluwer Academic Publishers
   schema:url <http://catdir.loc.gov/catdir/enhancements/fy0820/94001108-t.html> ;
   schema:workExample <http://worldcat.org/isbn/9780792394501> ;
   umbel:isLike <http://bnb.data.bl.uk/id/resource/GB9431628> ;
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/29754086> ;
    .


Related Entities

<http://dbpedia.org/resource/Boston> # Boston
    a schema:Place ;
   schema:name "Boston" ;
    .

<http://experiment.worldcat.org/entity/work/data/31718382#Agent/kluwer_academic_publishers> # Kluwer Academic Publishers
    a bgn:Agent ;
   schema:name "Kluwer Academic Publishers" ;
    .

<http://experiment.worldcat.org/entity/work/data/31718382#Series/kluwer_international_series_in_engineering_and_computer_science> # Kluwer international series in engineering and computer science ;
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/29754086> ; # Physical design for multichip modules
   schema:name "Kluwer international series in engineering and computer science ;" ;
    .

<http://experiment.worldcat.org/entity/work/data/31718382#Series/the_kluwer_international_series_in_engineering_and_computer_science> # The Kluwer international series in engineering and computer science ;
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/29754086> ; # Physical design for multichip modules
   schema:name "The Kluwer international series in engineering and computer science ;" ;
    .

<http://experiment.worldcat.org/entity/work/data/31718382#Thing/electronic_equipment> # Electronic equipment
    a schema:Thing ;
   schema:name "Electronic equipment" ;
    .

<http://experiment.worldcat.org/entity/work/data/31718382#Topic/multichip_modules_microelectronics_design_and_construction> # Multichip modules (Microelectronics)--Design and construction
    a schema:Intangible ;
   schema:hasPart <http://id.loc.gov/authorities/subjects/sh92002333> ;
   schema:name "Multichip modules (Microelectronics)--Design and construction"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/31718382#Topic/structures_multi_puces_micro_electronique> # Structures multi-puces (micro ́electronique)
    a schema:Intangible ;
   schema:name "Structures multi-puces (micro ́electronique)"@en ;
    .

<http://id.worldcat.org/fast/1028809> # Multichip modules (Microelectronics)--Design and construction
    a schema:Intangible ;
   schema:name "Multichip modules (Microelectronics)--Design and construction"@en ;
    .

<http://id.worldcat.org/fast/907417> # Electronic packaging--Design
    a schema:Intangible ;
   schema:name "Electronic packaging--Design"@en ;
    .

<http://viaf.org/viaf/13992960> # Mysore Sriram
    a schema:Person ;
   schema:birthDate "1966" ;
   schema:familyName "Sriram" ;
   schema:givenName "Mysore" ;
   schema:givenName "M." ;
   schema:name "Mysore Sriram" ;
    .

<http://viaf.org/viaf/5032414> # Sung-Mo Kang
    a schema:Person ;
   schema:birthDate "1945" ;
   schema:familyName "Kang" ;
   schema:givenName "Sung-Mo" ;
   schema:name "Sung-Mo Kang" ;
    .

<http://worldcat.org/isbn/9780792394501>
    a schema:ProductModel ;
   schema:isbn "079239450X" ;
   schema:isbn "9780792394501" ;
    .

<http://www.worldcat.org/oclc/624399093>
    a schema:CreativeWork ;
   rdfs:label "Physical design for multichip modules." ;
   schema:description "Online version:" ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/29754086> ; # Physical design for multichip modules
    .


Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.