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Plasma immersion ion implantation - a fledging technique for semiconductor processing

Author: Paul K Chu
Publisher: Lausanne : Elsevier, 1996.
Series: Materials science & engineering., R,, Reports : a review journal ;, 17, Nos. 6-7.
Edition/Format:   Print book : EnglishView all editions and formats
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Document Type: Book
All Authors / Contributors: Paul K Chu
OCLC Number: 36580417
Description: p. 207-280 : ill. ; 28 cm.
Series Title: Materials science & engineering., R,, Reports : a review journal ;, 17, Nos. 6-7.
Responsibility: Paul K. Chu, Shu Qin, Chung Chan, Nathan W. Cheung, Lawrence A. Larson.

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