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Proceedings : 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, the Adam's Mark Hotel, Denver, Colorado

Author: International Microelectronics and Packaging Society.
Publisher: [New York] : Institute of Electrical and Electronics Engineers, ©1998.
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
Database:WorldCat
Summary:

This volume covers topics including: multichip modules; micro/chip scale packaging; advanced PWBs; portables and IC packaging; MCM thermal management; modern wirebonding technology; polymers for  Read more...

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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Print version:
International Conference on Multichip Modules and High Density Packaging (1998 : Denver, Colo.).
Proceedings.
[New York] : Institute of Electrical and Electronics Engineers, ©1998
(DLC) 98084630
(OCoLC)39914256
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: International Microelectronics and Packaging Society.
ISBN: 0780348508 9780780348509 0780348516 9780780348516
OCLC Number: 47875589
Notes: "IEEE catalog number: 98EX154"--Title page verso.
Reproduction Notes: Electronic reproduction. [S.l.] : HathiTrust Digital Library, 2010. MiAaHDL
Description: 1 online resource (xi, 547 pages) : illustrations
Details: Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
Other Titles: Multichip modules and high density packaging
Multichip Modules and High Density Packaging, 1998, proceedings, 1998 7th International Conference on
Responsibility: sponsored by IMAPS [and others].

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