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Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 15-18, 1998

Author: C P Wong; International Microelectronics and Packaging Society.
Publisher: Reston, Va. : IMAPS ; Piscataway, N.J. : IEEE, [1998]
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
Summary:

This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high  Read more...

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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Print version:
International Symposium on Advanced Packaging Materials (4th : 1998 : Braselton, Ga.).
Proceedings.
Reston, Va. : IMAPS ; Piscataway, N.J. : IEEE, [1998]
(DLC) 98149250
(OCoLC)38946150
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: C P Wong; International Microelectronics and Packaging Society.
ISBN: 0780347951 9780780347953 078034796X 9780780347960
OCLC Number: 47885657
Language Note: English.
Notes: "IEEE catalog number 98EX153"--Title page verso.
Description: 1 online resource (300 pages) : illustrations
Other Titles: 4th International Symposium on Advanced Packaging Materials
4th International Symposium and Exhibition on Advanced Packaging Materials
1998 proceedings, International Symposium and Exhibition on Advanced Packaging Materials
Advanced Packaging Materials, 1998, proceedings, 1998 4th International Symposium on
Responsibility: co-sponsored by International Microelectronics and Packaging Society (IMAPS) [and others] ; general chair, C.P. Wong.

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