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Proceedings of the International Symposium on Advances in Interconnection and Packaging, 5-9 November 1990, Boston, Massachusetts

Author: Alfred P DeFonzo; Granallingham Arjavalingham; James Pazaris; Stuart K Tewksbury; John R Carruthers
Publisher: Bellingham, Wa. : SPIE, ©1991.
Series: SPIE - The International Society for Optical Engineering proceedings series, v. 1389-1390.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
International Symposium on Advances in Interconnection and Packaging (1990 : Boston, Mass.).
Proceedings of the International Symposium on Advances in Interconnection and Packaging, 5-9 November 1990, Boston, Massachusetts.
Bellingham, Wa.: SPIE, ©1991
(OCoLC)551595453
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Alfred P DeFonzo; Granallingham Arjavalingham; James Pazaris; Stuart K Tewksbury; John R Carruthers
ISBN: 081940456X 9780819404565
OCLC Number: 23592518
Description: 2 volumes : illustrations ; 28 cm.
Contents: Book 1. Microelectronic interconnects and packages : optical and electrical technologies / Granallingham Arjavalingham and James Pazaris, editors --
Book 2. Microelectronic interconnects and packages : system and process integration / Stuart K. Tewksbury and John R. Carruthers, editors.
Series Title: SPIE - The International Society for Optical Engineering proceedings series, v. 1389-1390.
Other Titles: Microelectronic interconnects and packages
Responsibility: Alfred P. DeFonzo, Symposium Chair / General Editor.

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