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Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials

Author: T O Herndon; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting
Publisher: Pennington, NJ : Electrochemical Society, ©1993.
Series: Proceedings (Electrochemical Society), v. 93-25.
Edition/Format:   Print book : Conference publication : English
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Genre/Form: Conference papers and proceedings
Honolulu (Hawaii, 1993)
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: T O Herndon; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting
ISBN: 156677067X 9781566770675
OCLC Number: 31412540
Notes: "Dielectric Science and Technology and Electronics Divisions."
Papers presented at two symposia, the Third International Symposium on Interconnects, Contact Metallization, and Multilevel Metallization and the Symposium on Reliability of Semiconductor Devices, Interconnects, and Thin Insulators Materials, held during the 183rd Meeting of the Electrochemical Society in Honolulu, Hawaii, May 16-21, 1993.
Spine title: Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.
Description: xiii, 494 pages : illustrations ; 23 cm.
Series Title: Proceedings (Electrochemical Society), v. 93-25.
Other Titles: Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.
Responsibility: edited by T.O. Herndon [and others].

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