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Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999, Nashville, Tennessee

Author: Erol Sancaktar; American Society of Mechanical Engineers. Design Engineering Division.
Publisher: New York, N.Y. : American Society of Mechanical Engineers, ©1999.
Series: DE (Series) (American Society of Mechanical Engineers. Design Engineering Division), v. 105.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Summary:

Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives  Read more...

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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections.
New York, N.Y. : American Society of Mechanical Engineers, ©1999
(OCoLC)606485099
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Erol Sancaktar; American Society of Mechanical Engineers. Design Engineering Division.
ISBN: 0791816591 9780791816592
OCLC Number: 43351689
Description: v, 171 pages : illustrations ; 28 cm.
Series Title: DE (Series) (American Society of Mechanical Engineers. Design Engineering Division), v. 105.
Responsibility: sponsored by the Design Engineering Divsion, ASME ; edited by Erol Sancaktar.

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