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Rohsenow Symposium on Future Trends in Heat Transfer

Author: John H Lienhard; Massachusetts Institute of Technology.
Publisher: [Cambridge, Mass.] : [Massachusetts Institute of Technology], [2003]
Edition/Format:   Print book : CD for computer : Document : Conference publication   Computer File : English
Database:WorldCat
Summary:
Proceedings of a conference covering four broad areas: phase-change heat transfer; advanced energy systems; heat transfer at the microscale and nanoscale; and heat transfer in electronics.
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Genre/Form: Conference papers and proceedings
Congresses
Named Person: Warren M Rohsenow; Warren M Rohsenow
Material Type: Conference publication, Document
Document Type: Book, Computer File
All Authors / Contributors: John H Lienhard; Massachusetts Institute of Technology.
OCLC Number: 52420249
Notes: Title from opening screen.
Held May 16, 2003 at MIT's Wong Auditorium.
"This symposium was held in honor of Warren M. Rohsenow on the occasion of the tenth anniversary of the naming of the MIT Heat and Mass Transfer Laboratory for him."
Description: 1 CD-ROM : color ; 4 3/4 in.
Details: System requirements: PC-compatible or Macintosh computer; web browser; Acrobat reader; CD-ROM drive.
Contents: Part 1: Phase-change heat transfer --
Phase change heat transfer: A perspective for the future / V.K. Dhir --
Phase change heat transfer: Response to Professor V.K. Dhir / C.T. Avedisian --
High-flux processes through enhanced heat transfer / A.E. Bergles --
Boiling enhancement: Response to Professor A.E. Bergles / G.F. Hewitt --
Part 2: Advanced energy systems --
Advanced nuclear energy systems: Heat transfer issues and trends / M.L. Corradini --
Hydrogen futures and technologies / C.W. Forsberg --
Improving energy efficiency 2-3%/year to save money and avoid global warming / A.H. Rosenfeld --
Part 3: Heat transfer at small dimensions --
Microscale thermal engineering of electronic systems / K.E. Goodson, et al. --
Nanoscale heat transfer and information technology / G. Chen --
Nanoscale transport phenomena at the interface of hard and soft matter / A. Majumdar --
Nanostructures and energy conversion / M.S. Dresselhaus --
Part 4: Electronics thermal management --
Thermal management roadmap: Cooling electronic products from hand-held devices to supercomputers / R.C. Chu, et al. --
Thermal management roadmap / A. Bar-Cohen --
MEMS-based thermal management of high heat flux devices edifice: Embedded droplet impingement for integrated cooling of electronics / C.H. Amon --
Thermal control of electronics: Perspectives and prospects / R.J. Hannemann --
Part 5: Extras --
The upper limit of thermocouple use and the lower limit for line reversal method used to measure temperature / J.P. Hartnett, W.C. Fuller, and W.M. Rohsenow --
A history of the MIT Heat Transfer Lab / J.H. Lienhard V --
List of heat transfer laboratory reports / A.E. Bergles.
Other Titles: Symposium on Future Trends in Heat Transfer
Rohsenow Symposium on Future Trends in heat Transfer, Proceedings, Friday, May 16, 2003
Proceedings of the Rohsenow Symposium on Future Trends in Heat Transfer
Responsibility: symposium chair, J.H. Lienhard.

Abstract:

Proceedings of a conference covering four broad areas: phase-change heat transfer; advanced energy systems; heat transfer at the microscale and nanoscale; and heat transfer in electronics.

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