přejít na obsah
Sample preparation handbook for transmission electron microscopy : techniques Náhled dokumentu
ZavřítNáhled dokumentu
Probíhá kontrola...

Sample preparation handbook for transmission electron microscopy : techniques

Autor Jeanne Ayache
Vydavatel: New York : Springer, ©2010.
Vydání/formát:   e-kniha : Document : EnglishZobrazit všechny vydání a formáty
Databáze:WorldCat
Shrnutí:

This is the second in a two-volume handbook on sample preparation for the transmission electron microscope. It describes 14 different preparation techniques, including 22 detailed protocols for  Přečíst více...

Hodnocení:

(ještě nehodnoceno) 0 zobrazit recenze - Buďte první.

Předmětová hesla:
Více podobných

 

Najít online exemplář

Odkazy na tento dokument

Vyhledat exemplář v knihovně

&AllPage.SpinnerRetrieving; Vyhledávání knihoven, které vlastní tento dokument...

Detaily

Žánr/forma: Electronic books
Handbooks, manuals, etc
Doplňující formát: Print version:
Sample preparation handbook for transmission electron microscopy.
New York : Springer, ©2010
(OCoLC)495781754
Typ materiálu: Document, Internetový zdroj
Typ dokumentu: Internet Resource, Computer File
Všichni autoři/tvůrci: Jeanne Ayache
ISBN: 9781441959744 1441959742 9781441959751 1441959750
OCLC číslo: 663096121
Popis: 1 online resource (xxv, 338 pages) : illustrations
Obsahy: Note continued: 5.4. Spectroscopic Contrast Imaging Modes in TEM and TEM/STEM --
5.5. EDS Chemical Analysis Methods in TEM and TEM/STEM --
5.6. EELS Spectroscopic Analysis Modes in TEM and TEM/STEM --
6. Conclusion and Information Assessment --
Bibliography --
4. Materials Problems and Approaches for TEM and TEM/STEM Analyses --
1. Introduction --
2. Analyses Conducted Prior to TEM Analyses --
2.1. Macroscopic Characterization --
2.2. Microscopic Characterization --
2.3. Microscopic and Nanoscopic Characterization --
3. Approach for Beginning the Investigation of a Material --
4. Selection of the Type of TEM Analysis --
5. Analysis of Topography --
6. Structural Analysis in TEM --
6.1. Morphology and Structure of Materials --
6.2. Atomic Structure --
7. Crystallographic Analysis --
8. Analysis of Crystal Defects: 1D (Dislocations), 2D (Grain Boundaries and Interfaces), and 3D (Precipitates) --
9. EDS Chemical Analysis and EELS Spectroscopic Analysis --
9.1. Phase Identification and Distribution --
9.2. Concentration Profiles and Interface Analysis --
10. Structural Analyses Under Special Conditions --
10.1. In Situ Analyses --
10.2. Cryomicroscopy --
11. Study of Properties --
11.1. Optical Properties --
11.2. Electrical Properties --
11.3. Electronic Properties --
11.4. Magnetic Properties --
11.5. Mechanical Properties --
11.6. Chemical Properties --
11.7. Functional Properties --
12. Relationship Between Sample Thickness and Analysis Type in TEM and TEM/STEM --
13. Assessment of TEM Analyses --
5. Physical and Chemical Mechanisms of Preparation Techniques --
1. Introduction --
2. Mechanical Action --
2.1. Principles of a Material's Mechanical Behavior --
2.2. Abrasion Principle --
2.3. Rupture Principles --
3. Chemical Action --
3.1. Principle of Chemical and Electrochemical Dissolution --
4. Ionic Action. Note continued: 4.1. Ionic Abrasion Principles --
4.2. Techniques Involving Ion Abrasion --
5. Actions Resulting in a State Change of Materials Containing an Aqueous Phase --
5.1. Elimination of the Aqueous Phase --
5.2. Freezing Principles --
5.3. Principle of Substitution, Infiltration, and Embedding in Cryogenic Mode --
5.4. Cryo-sublimation (or Freeze-Drying) Principle --
6. Actions Resulting in a Change in Material Properties --
6.1. Chemical Fixation Principles --
6.2. Dehydration Principles --
6.3. Infiltration Principles --
6.4. Embedding or Inclusion Principles --
6.5. "Positive-Staining" Contrast Principles --
7. Physical Actions Resulting in Deposition --
7.1. Physical Deposition --
7.2. Physics of the Coating Process --
7.3. Techniques Involving a Physical Deposition: Continuous or Holey Thin Film, Contrast Enhancement by Shadowing or Decoration, Replicas, and Freeze Fracture --
Bibliography --
Mechanical Action --
Chemical Action --
Ionic Action --
Actions Resulting in a State Change of Materials Containing an Aqueous Phase --
Actions Resulting in a Change in Material Properties --
Physical Actions Resulting in a Deposit --
6. Artifacts in Transmission Electron Microscopy --
1. Introduction --
2. Preparation-Induced Artifacts --
2.1. Mechanical Preparation-Induced Artifacts --
2.2. Ionic Preparation-Induced Artifacts --
2.3. Chemical Preparation-Induced Artifacts --
2.4. Physical Preparation-Induced Artifacts --
3. Artifacts Induced During TEM Observation --
3.1. Artifacts Not Linked to Thermal Damages --
3.2. Secondary Thermal Damage --
4. Examples of Artifacts --
4.1. Artifacts Induced by the Tripod Polishing Technique --
4.2. Artifacts Induced by the Ultramicrotomy Technique --
4.3. Artifacts Induced by the Freeze-Fracture Technique --
4.4. Artifacts Induced by Ion Milling or FIB. Note continued: 4.5. Artifacts Induced by the Substitution-Infiltration-Embedding Technique --
4.6. Artifacts Induced by Chemical Fixation --
4.7. Artifacts Induced by the Extractive-Replica Technique --
4.8. Artifacts Induced by the Shadowing Technique --
4.9. Artifacts Induced by the "Positive-Staining" Contrast Technique --
4.10. Artifacts Induced by the Cryofixation Technique --
4.11. Artifacts Induced by the Fine Particle Dispersion Technique --
4.12. Artifacts Induced by the Frozen-Hydrated-Film Technique --
4.13. Artifacts Induced by the "Negative-Staining" Contrast Technique --
4.14. Artifacts Induced by the Electron Beam --
5. Summary Tables --
Bibliography --
7. Selection of Preparation Techniques Based on Material Problems and TEM Analyses --
1. Introduction --
2. Classification of Preparation Techniques --
3. Characteristics of Preparation Techniques --
4. Criteria Used to Select a Preparation Technique --
5. Selection Criteria Based on Material Type --
6. Selection Criteria Based on Material Organization --
6.1. Bulk Materials --
6.2. Single-Layer or Multilayer Materials --
6.3. Fine Particles --
7. Selection Criteria Based on Material Properties --
7.1. Based on the Physical State of the Material --
7.2. Based on the Chemical Phases in the Material --
7.3. Based on the Electrical Properties of the Material --
7.4. Based on the Mechanical Properties of the Material --
8. Selection Criteria Related to the Type of TEM Analysis --
8.1. Preparation Techniques --
9. Selection of the Orientation of the Sample Section --
9.1. Microstructure Geometry --
9.2. Defect Geometry --
10. Selection Criteria Related to Artifacts Induced by the Preparation Technique --
11. Adaptation of the Technique Based on Problems Related to Observation --
11.1. Reducing Sample Thickness --
11.2. Increasing Contrast --
11.3. Reducing Charge Effects. Note continued: 11.4. Limitation of Strain Hardening --
11.5. Removal of Surface Amorphization --
11.6. Removal of Surface Contamination --
11.7. Final Cleaning of the Thin Slice --
12. Conclusion --
Bibliography --
8. Comparisons of Techniques --
1. Introduction --
2. Examples Using Fine Particle Materials --
2.1. Comparison of Mechanical Preparations and Replicas --
2.2. Comparison of "Negative-Staining" Contrast and Freeze-Fracture Techniques --
2.3. Comparison of "Negative-Staining" and Decoration-Shadowing Contrast Techniques --
2.4. Comparison of "Positive-Staining" and Decoration Shadowing Contrast Techniques --
3. Examples Using Bulk or Multilayer Materials --
3.1. Comparison Between Different Mechanical Preparations --
3.2. Comparison Between Mechanical Preparations and Ionic Preparations --
3.3. Comparison Between Mechanical Preparations and Electrolytic Preparations --
3.4. Comparison Between Techniques Specific to Biology --
3.5. Comparison Between All Techniques That Can Be Used in Biology on One Example: Collagen --
Bibliography --
9. Conclusion: What Is a Good Sample? --
1. Techniques: General Introduction --
2. Preliminary Preparation Techniques --
1. Sawing --
1.1. Principle --
1.2. Operating Mode --
1.3. Variants --
1.4. Advantages --
1.5. Limitations --
1.6. Compatible Techniques --
1.7. Risks --
1.8. Conclusion --
2. Ultrasonic Cutting --
2.1. Principle --
2.2. Operating Mode --
2.3. Variants --
2.4. Advantages --
2.5. Limitations --
2.6. Compatible Techniques --
2.7. Risks --
2.8. Conclusion --
3. Mechanical Polishing --
3.1. Principle --
3.2. Operating Mode --
3.3. Variants --
3.4. Advantages --
3.5. Limitations --
3.6. Compatible Techniques --
3.7. Risks --
3.8. Conclusion --
4. Dimpling --
4.1. Principle --
4.2. Operating Mode --
4.3. Variants --
4.4. Advantages. Note continued: 4.5. Limitations --
4.6. Compatible Techniques --
4.7. Risks --
4.8. Conclusion --
5. Electropolishing --
5.1. Principle --
5.2. Operating Mode --
5.3. Variants --
5.4. Advantages --
5.5. Limitations --
5.6. Compatible Techniques --
5.7. Risks --
5.8. Conclusion --
6. Chemical Polishing --
6.1. Principle --
6.2. Operating Mode --
6.3. Variants --
6.4. Advantages --
6.5. Limitations --
6.6. Compatible Techniques --
6.7. Risks --
6.8. Conclusion --
7. Sandwich Technique --
7.1. Principle --
7.2. Operating Mode --
7.3. Variants --
7.4. Advantages --
7.5. Limitations --
7.6. Compatible Techniques --
7.7. Risks --
7.8. Conclusion --
8. Embedding --
8.1. Principle --
8.2. Operating Mode --
8.3. Variants --
8.4. Advantages --
8.5. Limitations --
8.6. Compatible Techniques --
8.7. Risks --
8.8. Conclusion --
9. Substitution-Infiltration-Embedding at Room Temperature --
9.1. Principle --
9.2. Operating Mode --
9.3. Variants --
9.4. Advantages --
9.5. Limitations --
9.6. Compatible Techniques --
9.7. Risks --
9.8. Conclusion --
10. Substitution-Infiltration-Embedding at Low Temperatures --
10.1. Principle --
10.2. Operating Mode --
10.3. Variants --
10.4. Advantages --
10.5. Limitations --
10.6. Compatible Techniques --
10.7. Risks --
10.8. Conclusion --
11. Chemical Fixation --
11.1. Principle --
11.2. Operating Mode --
11.3. Variants --
11.4. Advantages --
11.5. Limitations --
11.6. Compatible Techniques --
11.7. Risks --
11.8. Conclusion --
12. Physical Fixation: Cryo-fixation --
12.1. Principle --
12.2. Operating Mode --
12.3. Variants --
12.4. Advantages --
12.5. Limitations --
12.6. Compatible Techniques --
12.7. Risks --
12.8. Conclusion --
13. Continuous Support Films --
13.1. Principle. Note continued: 13.2. Operating Mode --
13.3. Variant --
13.4. Advantages --
13.5. Limitations --
13.6. Compatible Techniques --
13.7. Risks --
13.8. Conclusion --
14. Holey Support Films --
14.1. Principle --
14.2. Operating Mode --
14.3. Variant --
14.4. Advantages --
14.5. Limitations --
14.6. Compatible Techniques --
14.7. Risks --
14.8. Conclusion --
Bibliography --
3. Thinning Preparation Techniques --
1. Twin-Jet Electrolytic Thinning --
1.1. Principle --
1.2. Operating Mode --
1.3. Variants --
1.4. Advantages --
1.5. Limitations --
1.6. Artifacts --
1.7. Type of Analysis --
1.8. Risks --
1.9. Conclusion --
2. Full-Bath Electrolytic Thinning ("Window Technique") --
2.1. Principle --
2.2. Operating Mode --
2.3. Variants --
2.4. Advantages --
2.5. Limitations --
2.6. Artifacts --
2.7. Type of Analysis --
2.8. Risks --
2.9. Conclusion --
3. Twin-Jet Chemical Thinning --
3.1. Principle --
3.2. Operating Mode --
3.3. Variants --
3.4. Advantages --
3.5. Limitations --
3.6. Artifacts --
3.7. Type of Analysis --
3.8. Risks --
3.9. Conclusion --
4. Full-Bath Chemical Thinning ("Window Technique") --
4.1. Principle --
4.2. Operating Mode --
4.3. Variants --
4.4. Advantages --
4.5. Limitations --
4.6. Artifacts --
4.7. Type of Analysis --
4.8. Risks --
4.9. Conclusion --
5. Ion Milling --
5.1. Principle --
5.2. Operating Mode --
5.3. Variants --
5.4. Advantages --
5.5. Limitations --
5.6. Artifacts --
5.7. Type of Analysis --
5.8. Risks --
5.9. Conclusion --
6. Focused Ion Beam Thinning (FIB) --
6.1. Principle --
6.2. Operating Mode --
6.3. Variants --
6.4. Advantages --
6.5. Limitations --
6.6. Artifacts --
6.7. Type of Analysis --
6.8. Risks --
6.9. Conclusion --
Bibliography --
4. Mechanical Preparation Techniques. Note continued: 1. Crushing --
1.1. Principle --
1.2. Operating Mode --
1.3. Variants --
1.4. Advantages --
1.5. Limitations --
1.6. Artifacts --
1.7. Type of Analysis --
1.8. Risks --
1.9. Conclusion --
2. Wedge Cleavage --
2.1. Principle --
2.2. Operating Mode --
2.3. Variants --
2.4. Advantages --
2.5. Limitations --
2.6. Artifacts --
2.7. Type of Analysis --
2.8. Risks --
2.9. Conclusion --
3. Tripod Polishing --
3.1. Principle --
3.2. Operating Mode --
3.3. Variants --
3.4. Advantages --
3.5. Limitations --
3.6. Artifacts --
3.7. Type of Analysis --
3.8. Risks --
3.9. Conclusion --
4. Ultramicrotomy --
4.1. Principle --
4.2. Operating Mode --
4.3. Variants --
4.4. Advantages --
4.5. Limitations --
4.6. Artifacts --
4.7. Type of Analysis --
4.8. Risks --
4.9. Conclusion --
5. Cryo-ultramicrotomy --
5.1. Principle --
5.2. Operating Mode --
5.3. Variants --
5.4. Advantage --
5.5. Limitations --
5.6. Artifacts --
5.7. Type of Analysis --
5.8. Risks --
5.9. Conclusion --
Bibliography --
5. Replica Techniques --
1. Direct Replica Technique --
1.1. Principle --
1.2. Operating Mode --
1.3. Variants --
1.4. Advantages --
1.5. Limitations --
1.6. Artifacts --
1.7. Type of Analysis --
1.8. Risks --
1.9. Conclusion --
2. Indirect Replica --
2.1. Principle --
2.2. Operating Mode --
2.3. Variants --
2.4. Advantages --
2.5. Limitations --
2.6. Artifacts --
2.7. Type of Analysis --
2.8. Risks --
2.9. Conclusion --
3. Extractive Replica --
3.1. Principle --
3.2. Operating Mode --
3.3. Variants --
3.4. Advantages --
3.5. Limitations --
3.6. Artifacts --
3.7. Type of Analysis --
3.8. Risks --
3.9. Conclusion --
4. Freeze Fracture --
4.1. Principle --
4.2. Operating Mode --
4.3. Variants --
4.4. Advantages. Note continued: 4.5. Limitations --
4.6. Artifacts --
4.7. Type of Analysis --
4.8. Risks --
4.9. Conclusion --
Bibliography --
6. Techniques Specific to Fine Particles --
1. Dispersion of Fine Particle Materials --
1.1. Principle --
1.2. Operating Mode --
1.3. Variants --
1.4. Advantages --
1.5. Limitations --
1.6. Artifacts --
1.7. Type of Analysis --
1.8. Risks --
1.9. Conclusion --
2. Frozen Hydrated Film of Single Particles --
2.1. Principle --
2.2. Operating Mode --
2.3. Variants --
2.4. Advantages --
2.5. Limitations --
2.6. Artifacts --
2.7. Type of Analysis --
2.8. Risks --
2.9. Conclusion --
Bibliography --
7. Contrast Enhancement and Labeling Techniques --
1. Decoration Shadowing --
1.1. Principle --
1.2. Operating Mode --
1.3. Variants --
1.4. Advantages --
1.5. Limitations --
1.6. Artifacts --
1.7. Type of Analysis --
1.8. Risks --
1.9. Conclusion --
2. Negative Staining --
2.1. Principle --
2.2. Operating Mode --
2.3. Variants --
2.4. Advantages --
2.5. Limitations --
2.6. Artifacts --
2.7. Type of Analysis --
2.8. Risks --
2.9. Conclusion --
3. Positive Staining --
3.1. Principle --
3.2. Operating Mode --
3.3. Variants --
3.4. Advantages --
3.5. Limitations --
3.6. Artifacts --
3.7. Type of Analysis --
3.8. Risks --
3.9. Conclusion --
4. Immunolabeling --
4.1. Principle --
4.2. Operating Mode --
4.3. Variants --
4.4. Advantages --
4.5. Limitations --
4.6. Artifacts --
4.7. Type of Analysis --
4.8. Risks --
4.9. Conclusion --
Bibliography.
Odpovědnost: Jeanne Ayache [and others] ; foreword by Ron Anderson.
Více informací:

Recenze

Recenze redakce

Souhrn od vydavatele

From the reviews: "This textbook is the combined result ... of four French microscopists and one Swiss microscopist who use similar TEM techniques for the study of quite different specimens; this Přečíst více...

 
Recenze vložené uživatelem
Nahrávání recenzí GoodReads...
Přebírání recenzí DOGO books...

Štítky

Buďte první.
Potvrdit tento požadavek

Tento dokument jste si již vyžádali. Prosím vyberte Ok pokud chcete přesto v žádance pokračovat.

Propojená data


<http://www.worldcat.org/oclc/663096121>
library:oclcnum"663096121"
library:placeOfPublication
library:placeOfPublication
owl:sameAs<info:oclcnum/663096121>
rdf:typeschema:Book
schema:about
schema:about
schema:about
schema:about
<http://id.worldcat.org/fast/1154861>
rdf:typeschema:Intangible
schema:name"Transmission electron microscopy--Technique"@en
schema:name"Transmission electron microscopy--Technique."@en
schema:about
schema:about
schema:about
<http://id.worldcat.org/fast/1028396>
rdf:typeschema:Intangible
schema:name"Mounting of microscope specimens"@en
schema:name"Mounting of microscope specimens."@en
schema:bookFormatschema:EBook
schema:contributor
schema:copyrightYear"2010"
schema:datePublished"2010"
schema:exampleOfWork<http://worldcat.org/entity/work/id/1155233602>
schema:genre"Electronic books."@en
schema:genre"Handbooks, manuals, etc."@en
schema:inLanguage"en"
schema:name"Sample preparation handbook for transmission electron microscopy techniques"@en
schema:publisher
schema:url<http://public.eblib.com/choice/publicfullrecord.aspx?p=603093>
schema:url<http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=337952>
schema:url
schema:url<http://dx.doi.org/10.1007/978-1-4419-5975-1>
schema:url<http://site.ebrary.com/id/10395403>
schema:workExample
schema:workExample

Content-negotiable representations

Zavřít okno

Prosím přihlaste se do WorldCat 

Nemáte účet? Můžete si jednoduše vytvořit bezplatný účet.