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Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA : 1995 proceedings

Author: Glenn Chapman; Stuart Tewksbury; IEEE Computer Society.; Components, Packaging & Manufacturing Technology Society.
Publisher: [Piscataway, N.J.?] : [IEEE] : Distributed by IEEE Service Center, ©1995.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
International Conference on Wafer Scale Integration (7th : 1995 : San Francisco, Calif.).
Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA.
[Piscataway, N.J.? : IEEE] : Distributed by IEEE Service Center, ©1995
(OCoLC)762284539
Material Type: Conference publication, Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: Glenn Chapman; Stuart Tewksbury; IEEE Computer Society.; Components, Packaging & Manufacturing Technology Society.
ISBN: 0780324668 9780780324664 0780324676 9780780324671 0780324684 9780780324688
OCLC Number: 32540968
Notes: "IEEE Catalog number 95CH3574-2"--Title page verso.
Description: ix, 382 pages : illustrations ; 23 cm
Other Titles: Wafer Scale Integration, 1995, proceedings, Seventh Annual IEEE International Conference on.
1995 proceedings, Seventh Annual IEEE International Conference on Wafer Scale Integration
1995 IEEE International Conference on Wafer Scale Integration
Responsibility: sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by Stuart Tewksbury and Glenn Chapman.

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