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Silicon run. / II

Author: Ruth A CarranzaNational Science Foundation (U.S.)Intel Foundation.Apple Computer, Inc.Semiconductor Equipment and Materials Institute.All authors
Publisher: Mountain View, CA : Ruth Carranza Productions, ©1993.
Edition/Format:   VHS video : VHS tape : Partial animation   Visual material : EnglishView all editions and formats
Database:WorldCat
Summary:
Follows the manufacturing process by which IC wafers are made into chips used in microcomputers and multichip units of high-end computers. Illustrates back-end manufacturing from testing through packaging, PC board design and assembly, systems assembly, computer structure, and multichip technology.
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Genre/Form: Documentary television programs
Educational films
Material Type: Partial animation, Videorecording
Document Type: Visual material
All Authors / Contributors: Ruth A Carranza; National Science Foundation (U.S.); Intel Foundation.; Apple Computer, Inc.; Semiconductor Equipment and Materials Institute.; Digital Equipment Corporation.; Stanford University. Department of Electrical Engineering. Center for Integrated Systems.; Ruth Carranza Productions.
OCLC Number: 29491384
Notes: A presentation of the National Science Foundation, Intel Foundation, Apple Computer, Inc., Digital Equipment Corporation, Semiconductor Equipment and Materials Institute, Inc., Stanford University. Department of Electrical Engineering. Center for Integrated Systems.
"The companion tape to Silicon run. I"--Container.
Credits: Writer/producer/director, Ruth A. Carranza ; cinematography, Wah Ho Chan ; music, Neil Panton.
Performer(s): Susan Jerome.
Description: 1 videocassette (35 min.) : sd., col. ; 1/2 in.
Contents: Introduction --
Silicon run I review --
Testing & packaging --
IC devices --
Circuit board assembly --
System assembly --
Computer architecture --
Multichip technology --
Ending & credits.
Other Titles: Silicon run two
Responsibility: a film by Ruth A. Carranza.

Abstract:

Follows the manufacturing process by which IC wafers are made into chips used in microcomputers and multichip units of high-end computers. Illustrates back-end manufacturing from testing through packaging, PC board design and assembly, systems assembly, computer structure, and multichip technology.

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