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Silicon wafer bonding technology : for VLSI and MEMS applications

Author: Subramanian S Iyer; Andre J Auberton-Hervé; Institution of Electrical Engineers.; INSPEC. EMIS Group.
Publisher: London : Institution of Electrical Engineers, ©2002.
Series: EMIS processing series, no. 1.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

Silicon-on-insulator (SOI) technology in microelectronics is proliferating and is ready to be applied in a growing number of IC fabrication situations. Bonding of single crystal Si to dielectrics,  Read more...

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Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: Subramanian S Iyer; Andre J Auberton-Hervé; Institution of Electrical Engineers.; INSPEC. EMIS Group.
ISBN: 0852960395 9780852960394
OCLC Number: 48026089
Description: xxv, 149 pages : illustrations ; 26 cm.
Contents: Introduction and overview / S.S. Iyer --
Principles of wafer bonding / Q.-Y. Tong --
Wafer Bonding Basics --
Surface smoothness --
Surface flatness --
Surface cleanliness --
Standard wafer bonding and layer transfer procedures --
Generic Nature of Wafer Bonding --
Low Temperature Wafer Bonding --
Room temperature covalent bonding --
Low temperature epitaxial wafer bonding --
Bond, grind-back and polish SOI / K. Mitani --
Processing --
Fabrication process flow --
Initial bonding --
Bonding anneal --
Thinning by grinding and polishing --
Thinning by PACE --
Wafer size availability --
Physical and Electrical Properties --
Warpage and stress --
Crystal defects --
Fixed charges in BOX --
Smart Cut: the technology used for high volume SOI wafer production / B. Aspar, A.J. Auberton-Herve --
Processing --
Physical Mechanisms --
Effect of hydrogen implantation in silicon --
Splitting kinetics --
Cleaning and bonding --
Applications --
Silicon on insulator wafers --
Transfer of thin semiconductor films on new bonded layers --
Transfer of materials other than silicon --
ELTRAN (SOI-Epi wafer) technology / T. Yonehara --
Special Features of ELTRAN --
SOI-Epi wafer --
Surface smoothing techniques --
Film thickness control --
Cloning (wafer recycling) --
Processing --
Anodization --
Epitaxial growth --
Bonding and splitting --
Etching --
Hydrogen annealing --
Applicability and Comparisons --
SOI/BOX thickness requirement for various SOI device applications --
Ultra thin SOI --
Comparisons --
Cost Reduction and Scalability.
Series Title: EMIS processing series, no. 1.
Responsibility: edited by Subramanian S. Iyer and Andre J. Auberton-Hervé.
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