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Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

Author: D Agonafer; American Society of Mechanical Engineers. Heat Transfer Division.
Publisher: New York, N.Y. : American Society of Mechanical Engineers, ©1993.
Series: HTD (Series), v. 255.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
National Heat Transfer Conference (29th : 1993 : Atlanta, Ga.).
Solutions to CFD benchmark problems in electronic packaging.
New York, N.Y. : American Society of Mechanical Engineers, ©1993
(OCoLC)624310121
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: D Agonafer; American Society of Mechanical Engineers. Heat Transfer Division.
ISBN: 0791811689 9780791811689
OCLC Number: 28897055
Description: v, 57 pages : illustrations ; 28 cm.
Series Title: HTD (Series), v. 255.
Responsibility: sponsored by the Heat Transfer Division, ASME ; edited by Dereje Agonafer.

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