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Stress-induced phenomena in metallization : Eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010

Author: Ehrenfried Zschech; P S Ho; Shinichi Ogawa
Publisher: Melville, N.Y. : American Institute of Physics, 2010.
Series: AIP conference proceedings, no. 1300.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Summary:

Understanding stress-related phenomena in new materials used for 3D integration and packaging, particularly using through silicon vias and microbumps, is critical for future microelectronic products.  Read more...

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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Ehrenfried Zschech; P S Ho; Shinichi Ogawa
ISBN: 9780735408555 0735408556
OCLC Number: 699514242
Description: xi, 257 pages : illustrations ; 24 cm.
Contents: Copper interconnects : microstructure and interfaces --
Sub-100nm metal interconnects --
Advanced stress characterization techniques --
Mechanical properties of materials --
3D integration and packaging : materials and reliability.
Series Title: AIP conference proceedings, no. 1300.
Other Titles: Eleventh International Workshop on Stress-Induced Phenomena in Metallization
International Workshop on Stress-Induced Phenomena in Metallization
Responsibility: editors, Ehrenfried Zschech, Paul S. Ho, Shinichi Ogawa.
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