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Stress-induced phenomena in metallization : Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008

Author: P S Ho; Shinichi Ogawa; Ehrenfried Zschech
Publisher: Melville, N.Y. : American Institute of Physics, 2009.
Series: AIP conference proceedings, no. 1143.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Database:WorldCat
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Genre/Form: Congresses
Additional Physical Format: Online version:
International Workshop on Stress-Induced Phenomena in Metallization (10th : 2008 : Austin, Texas).
Stress-induced phenomena in metallization.
Melville, N.Y. : American Institute of Physics, ; 2009
(OCoLC)714735693
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: P S Ho; Shinichi Ogawa; Ehrenfried Zschech
ISBN: 9780735406803 0735406804
OCLC Number: 426030732
Description: vii, 233 pages : illustrations ; 24 cm.
Contents: Electromigration in copper interconnects --
Low-K dielectrics and barrier layers --
Microstructure and stress behavior of Cu structures --
Chip package interaction, nanostructures and 3D interconnects.
Series Title: AIP conference proceedings, no. 1143.
Other Titles: Tenth International Workshop on Stress-Induced Phenomena in Metallization
International Workshop on Stress-Induced Phenomena in Metallization
Responsibility: editors, Paul S. Ho, Shinichi Ogawa, Ehrenfried Zschech ; sponsoring organization, the University of Texas at Austin.
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