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Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices

Author: L -T Yeh; R C Chu; American Society of Mechanical Engineers.
Publisher: New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016) : American Society of Mechanical Engineers, 2002.
Series: ASME Press book series on electronic packaging.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
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Genre/Form: Electronic books
Additional Physical Format: Print version:
(DLC) 2001034086
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: L -T Yeh; R C Chu; American Society of Mechanical Engineers.
OCLC Number: 694249523
Notes: Title from PDF title page (ASME eBooks Web site, viewed 12/04/2010).
Description: 1 online resource (xxi, 414 pages) : illustrations.
Contents: 1. Introduction --
2. Conduction --
3. Convection --
4. Radiation --
5. Pool boiling --
6. Flow boiling --
7. Condensation --
8. Extended surfaces --
9. Thermal interface resistance --
10. Components and printed circuit boards --
11. Direct air cooling and fans --
12. Natural and mixed convection --
13. Heat exchangers and cold plates --
14. Advanced cooling technologies I: single-phase liquid cooling --
15. Advanced cooling technologies II: two-phase flow cooling --
16. Heat pipes --
17. Thermoelectric coolers.
Series Title: ASME Press book series on electronic packaging.
Responsibility: L.T. Yeh, R.C. Chu.

Abstract:

With this systematic examination of the factors that govern the thermal performance of electronics, the authors solve design problems encountered in developing and analysing very-high-performance and  Read more...

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Primary Entity

<http://www.worldcat.org/oclc/694249523> # Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices
    a schema:CreativeWork, schema:Book, schema:MediaObject ;
   library:oclcnum "694249523" ;
   library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/20351033#Place/new_york_n_y_asme_three_park_avenue_new_york_ny_10016> ; # New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016)
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/nyu> ;
   schema:about <http://id.worldcat.org/fast/953826> ; # Heat--Transmission
   schema:about <http://id.loc.gov/authorities/subjects/sh85059767> ; # Heat--Transmission
   schema:about <http://id.worldcat.org/fast/906842> ; # Electronic apparatus and appliances--Thermal properties
   schema:about <http://id.loc.gov/authorities/subjects/sh85042255> ; # Electronic apparatus and appliances--Cooling
   schema:about <http://dewey.info/class/621.38104/e21/> ;
   schema:about <http://id.loc.gov/authorities/subjects/sh88000825> ; # Electronic apparatus and appliances--Thermal properties
   schema:about <http://id.worldcat.org/fast/906780> ; # Electronic apparatus and appliances--Cooling
   schema:bookFormat schema:EBook ;
   schema:contributor <http://viaf.org/viaf/124158527> ; # American Society of Mechanical Engineers.
   schema:contributor <http://viaf.org/viaf/75655203> ; # Richard C. Chu
   schema:creator <http://viaf.org/viaf/166457879> ; # Lian-Tuu Yeh
   schema:datePublished "2002" ;
   schema:description "With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies."@en ;
   schema:description "1. Introduction -- 2. Conduction -- 3. Convection -- 4. Radiation -- 5. Pool boiling -- 6. Flow boiling -- 7. Condensation -- 8. Extended surfaces -- 9. Thermal interface resistance -- 10. Components and printed circuit boards -- 11. Direct air cooling and fans -- 12. Natural and mixed convection -- 13. Heat exchangers and cold plates -- 14. Advanced cooling technologies I: single-phase liquid cooling -- 15. Advanced cooling technologies II: two-phase flow cooling -- 16. Heat pipes -- 17. Thermoelectric coolers."@en ;
   schema:exampleOfWork <http://worldcat.org/entity/work/id/20351033> ;
   schema:genre "Electronic books"@en ;
   schema:inLanguage "en" ;
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/20351033#Series/asme_press_book_series_on_electronic_packaging> ; # ASME Press book series on electronic packaging.
   schema:isSimilarTo <http://worldcat.org/entity/work/data/20351033#CreativeWork/> ;
   schema:name "Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices"@en ;
   schema:productID "694249523" ;
   schema:publication <http://www.worldcat.org/title/-/oclc/694249523#PublicationEvent/new_york_n_y_asme_three_park_avenue_new_york_ny_10016_american_society_of_mechanical_engineers_2002> ;
   schema:publisher <http://experiment.worldcat.org/entity/work/data/20351033#Agent/american_society_of_mechanical_engineers> ; # American Society of Mechanical Engineers
   schema:url <https://login.proxy.lib.strath.ac.uk/login?url=http://ebooks.asmedigitalcollection.asme.org/book.aspx?bookid=234> ;
   schema:url <http://dx.doi.org/10.1115/1.801683> ;
   schema:workExample <http://dx.doi.org/10.1115/1.801683> ;
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/694249523> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/20351033#Agent/american_society_of_mechanical_engineers> # American Society of Mechanical Engineers
    a bgn:Agent ;
   schema:name "American Society of Mechanical Engineers" ;
    .

<http://experiment.worldcat.org/entity/work/data/20351033#Place/new_york_n_y_asme_three_park_avenue_new_york_ny_10016> # New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016)
    a schema:Place ;
   schema:name "New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016)" ;
    .

<http://experiment.worldcat.org/entity/work/data/20351033#Series/asme_press_book_series_on_electronic_packaging> # ASME Press book series on electronic packaging.
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/694249523> ; # Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices
   schema:name "ASME Press book series on electronic packaging." ;
   schema:name "ASME Press book series on electronic packaging" ;
    .

<http://id.loc.gov/authorities/subjects/sh85042255> # Electronic apparatus and appliances--Cooling
    a schema:Intangible ;
   schema:name "Electronic apparatus and appliances--Cooling"@en ;
    .

<http://id.loc.gov/authorities/subjects/sh85059767> # Heat--Transmission
    a schema:Intangible ;
   schema:name "Heat--Transmission"@en ;
    .

<http://id.loc.gov/authorities/subjects/sh88000825> # Electronic apparatus and appliances--Thermal properties
    a schema:Intangible ;
   schema:name "Electronic apparatus and appliances--Thermal properties"@en ;
    .

<http://id.worldcat.org/fast/906780> # Electronic apparatus and appliances--Cooling
    a schema:Intangible ;
   schema:name "Electronic apparatus and appliances--Cooling"@en ;
    .

<http://id.worldcat.org/fast/906842> # Electronic apparatus and appliances--Thermal properties
    a schema:Intangible ;
   schema:name "Electronic apparatus and appliances--Thermal properties"@en ;
    .

<http://id.worldcat.org/fast/953826> # Heat--Transmission
    a schema:Intangible ;
   schema:name "Heat--Transmission"@en ;
    .

<http://viaf.org/viaf/124158527> # American Society of Mechanical Engineers.
    a schema:Organization ;
   schema:name "American Society of Mechanical Engineers." ;
    .

<http://viaf.org/viaf/166457879> # Lian-Tuu Yeh
    a schema:Person ;
   schema:birthDate "1944" ;
   schema:familyName "Yeh" ;
   schema:givenName "Lian-Tuu" ;
   schema:givenName "L.-T" ;
   schema:name "Lian-Tuu Yeh" ;
    .

<http://viaf.org/viaf/75655203> # Richard C. Chu
    a schema:Person ;
   schema:birthDate "1933" ;
   schema:familyName "Chu" ;
   schema:givenName "Richard C." ;
   schema:givenName "R. C." ;
   schema:name "Richard C. Chu" ;
    .

<http://worldcat.org/entity/work/data/20351033#CreativeWork/>
    a schema:CreativeWork ;
   schema:description "Print version:" ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/694249523> ; # Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices
    .

<http://www.worldcat.org/title/-/oclc/694249523>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
   schema:about <http://www.worldcat.org/oclc/694249523> ; # Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices
   schema:dateModified "2017-09-02" ;
   void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


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