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Thermal stress and strain in microelectronics packaging

Author: John H Lau
Publisher: New York : Van Nostrand Reinhold, ©1993.
Edition/Format:   Print book : EnglishView all editions and formats
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Additional Physical Format: Online version:
Thermal stress and strain in microelectronics packaging.
New York : Van Nostrand Reinhold, ©1993
(OCoLC)624194450
Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: John H Lau
ISBN: 0442010583 9780442010584
OCLC Number: 27107879
Description: xxii, 883 pages : illustrations ; 24 cm
Contents: 1. Thermomechanics for Electronics Packaging --
2. Thermal Expansivity and Thermal Stress in Multilayered Structures --
3. Thermal Stresses in Anisotropic Multilayered Structures --
4. Transient Thermal Stresses in Multilayered Devices --
5. Temperature Dependence of Thermal Expansion of Materials for Electronics Packages --
6. Thermal Stress Considerations in Die-Attachment --
7. Die Stress Measurement Using Piezoresistive Stress Sensors --
8. Analysis of the Thermal Loading on Electronics Packages by Enhanced Moire Interferometry --
9. Correlation of Analytical and Experimental Approaches to Determination of Thermally Induced Printed Wiring Board (PWB) Warpage --
10. Thermal Stress-Induced Open-Circuit Failure in Microelectronics Thin-Film Metallizations --
11. Thermal Stress and Stress-Induced Voiding in Passivated Narrow Line Metallizations on Ceramic Substrates --
12. Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices --
13. Thermal and Moisture Stresses in Plastic Packages --
14. Solutions to Moisture Resistance Degradation During Solder Reflow of Plastic Surface Mount Components --
15. Thermomechanical Fatigue of 63Sn-37Pb Solder Joints --
16. A Prediction of the Thermal Fatigue Life of Solder Joints Using Crack Propagation Rate and Equivalent Strain Range --
17. Microstructural Evaluation of Sn-Pb Solder and Pd-Ag Thick-Film Conductor Metallization Under Thermal Cycling and Aging Conditions --
18. Solder Joint Reliability of Leadless Chip Carriers --
19. Solder Creep-Fatigue Interactions with Flexible Leaded Surface Mount Components --
20. Thermal Stress Issues in Plated-Through-Hole Reliability --
21. Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate --
22. Mechanics of Wirebond Interconnects --
23. Corrosion in Microelectronics Packages.
Responsibility: edited by John H. Lau.

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