skip to content
THERMINIC 2015 : 21st International Workshop Thermal Investigations of ICs and Systems : September 30 - October 2, 2015 @ Paris, FR Preview this item
ClosePreview this item
Checking...

THERMINIC 2015 : 21st International Workshop Thermal Investigations of ICs and Systems : September 30 - October 2, 2015 @ Paris, FR

Author: Components, Packaging & Manufacturing Technology Society,; Centre national de la recherche scientifique (France),; CentraleSupélec (Organization),; Institute of Electrical and Electronics Engineers,
Publisher: [Piscataway, New Jersey] : IEEE, [2015?]
Edition/Format:   eBook : Document : Conference publication : English
Summary:
Annotation

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems For academics and industrialists involved in both micro and power electronics.

Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

 

Find a copy online

Links to this item

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Genre/Form: Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Components, Packaging & Manufacturing Technology Society,; Centre national de la recherche scientifique (France),; CentraleSupélec (Organization),; Institute of Electrical and Electronics Engineers,
OCLC Number: 956675216
Description: 1 online resource : illustrations
Other Titles: 21st International Workshop Thermal Investigations of ICs and Systems
Thermal Investigations of ICs and Systems (THERMINIC), 2015 21st International Workshop on
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Responsibility: sponsored by CPMT [and 9 others] ; organized by CNRS, CentraleSupélec.

Abstract:

Annotation

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems For academics and industrialists involved in both micro and power electronics.

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity

<http://www.worldcat.org/oclc/956675216> # THERMINIC 2015 : 21st International Workshop Thermal Investigations of ICs and Systems : September 30 - October 2, 2015 @ Paris, FR
    a schema:CreativeWork, schema:MediaObject, schema:Book ;
   library:oclcnum "956675216" ;
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/nju> ;
   schema:about <http://experiment.worldcat.org/entity/work/data/3795502649#Topic/microelectronics_materials_thermal_properties> ; # Microelectronics--Materials--Thermal properties
   schema:alternateName "Thermal Investigations of ICs and Systems (THERMINIC), 2015 21st International Workshop on" ;
   schema:alternateName "2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)" ;
   schema:alternateName "21st International Workshop Thermal Investigations of ICs and Systems" ;
   schema:bookFormat schema:EBook ;
   schema:contributor <http://experiment.worldcat.org/entity/work/data/3795502649#Organization/centre_national_de_la_recherche_scientifique_france> ; # Centre national de la recherche scientifique (France),
   schema:contributor <http://experiment.worldcat.org/entity/work/data/3795502649#Organization/institute_of_electrical_and_electronics_engineers> ; # Institute of Electrical and Electronics Engineers,
   schema:contributor <http://experiment.worldcat.org/entity/work/data/3795502649#Organization/centralesupelec_organization> ; # CentraleSupélec (Organization),
   schema:contributor <http://experiment.worldcat.org/entity/work/data/3795502649#Organization/components_packaging_&_manufacturing_technology_society> ; # Components, Packaging & Manufacturing Technology Society,
   schema:creator <http://experiment.worldcat.org/entity/work/data/3795502649#Meeting/international_workshop_on_thermal_investigations_of_ics_and_microstructures_21st_2015_paris_france> ; # International Workshop on Thermal Investigations of ICs and Microstructures (21st : 2015 : Paris, France)
   schema:datePublished "2015" ;
   schema:description "Annotation"@en ;
   schema:exampleOfWork <http://worldcat.org/entity/work/id/3795502649> ;
   schema:genre "Conference publication"@en ;
   schema:inLanguage "en" ;
   schema:name "THERMINIC 2015 : 21st International Workshop Thermal Investigations of ICs and Systems : September 30 - October 2, 2015 @ Paris, FR"@en ;
   schema:productID "956675216" ;
   schema:url <http://ezproxy.uis.edu:2048/login?url=http://ieeexplore.ieee.org/servlet/opac?punumber=7365562> ;
   schema:url <http://ieeexplore.ieee.org/servlet/opac?punumber=7365562> ;
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/956675216> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/3795502649#Meeting/international_workshop_on_thermal_investigations_of_ics_and_microstructures_21st_2015_paris_france> # International Workshop on Thermal Investigations of ICs and Microstructures (21st : 2015 : Paris, France)
    a bgn:Meeting, schema:Event ;
   schema:location <http://experiment.worldcat.org/entity/work/data/3795502649#Place/paris_france> ; # Paris, France)
   schema:name "International Workshop on Thermal Investigations of ICs and Microstructures (21st : 2015 : Paris, France)" ;
    .

<http://experiment.worldcat.org/entity/work/data/3795502649#Organization/centralesupelec_organization> # CentraleSupélec (Organization),
    a schema:Organization ;
   schema:name "CentraleSupélec (Organization)," ;
    .

<http://experiment.worldcat.org/entity/work/data/3795502649#Organization/centre_national_de_la_recherche_scientifique_france> # Centre national de la recherche scientifique (France),
    a schema:Organization ;
   schema:name "Centre national de la recherche scientifique (France)," ;
    .

<http://experiment.worldcat.org/entity/work/data/3795502649#Organization/components_packaging_&_manufacturing_technology_society> # Components, Packaging & Manufacturing Technology Society,
    a schema:Organization ;
   schema:name "Components, Packaging & Manufacturing Technology Society," ;
    .

<http://experiment.worldcat.org/entity/work/data/3795502649#Organization/institute_of_electrical_and_electronics_engineers> # Institute of Electrical and Electronics Engineers,
    a schema:Organization ;
   schema:name "Institute of Electrical and Electronics Engineers," ;
    .

<http://experiment.worldcat.org/entity/work/data/3795502649#Topic/microelectronics_materials_thermal_properties> # Microelectronics--Materials--Thermal properties
    a schema:Intangible ;
   schema:name "Microelectronics--Materials--Thermal properties"@en ;
    .

<http://www.worldcat.org/title/-/oclc/956675216>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
   schema:about <http://www.worldcat.org/oclc/956675216> ; # THERMINIC 2015 : 21st International Workshop Thermal Investigations of ICs and Systems : September 30 - October 2, 2015 @ Paris, FR
   schema:dateModified "2017-10-21" ;
   void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.