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Thirty-Second IEEE International Electronics Manufacturing Technology Symposium : and Twelfth IEEE International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces : October 3-5, 2007, Holiday Inn San Jose, San Jose/Silicon Valley, CA, USA Preview this item
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Thirty-Second IEEE International Electronics Manufacturing Technology Symposium : and Twelfth IEEE International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces : October 3-5, 2007, Holiday Inn San Jose, San Jose/Silicon Valley, CA, USA

Publisher: Piscataway, N.J. : Institute of Electrical and Electronics Engineers, ©2007.
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Electronic books
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
OCLC Number: 259708953
Notes: Title from PDF title page screen (IEEE Xplore, viewed Oct. 1, 2008).
Description: 1 online resource (1 volume) : illustrations (some color)
Other Titles: Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
32nd IEEE International Electronics Manufacturing Technology Symposium
Twelfth IEEE International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces
12th International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces, 2007
APM 2007
Responsibility: organized and sponsored by the IEEE Components, Packaging and Manufacturing Technology Society, and the Santa Clara Valley Chapter of the CPMT Society.

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