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Transport phenomena in thermal engineering : proceedings of the Sixth International Symposium on Transport Phenomena in Thermal Engineering (ISTP-VI), Seoul, Korea, May 9-13

Author: Joon Sik Lee; Suk Ho Chung; Ki Hyun Kim; Pacific Center of Thermal-Fluids Engineering.
Publisher: New York : Begell House, 1993.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Database:WorldCat
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Joon Sik Lee; Suk Ho Chung; Ki Hyun Kim; Pacific Center of Thermal-Fluids Engineering.
ISBN: 1567000150 9781567000153
OCLC Number: 29224736
Description: 2 volumes : illustrations ; 28 cm
Responsibility: organized under the auspices of Pacific Center of Thermal-Fluids Engineering ; edited by Joon Sik Lee, Suk Ho Chung, Ki Hyun Kim.

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