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Untersuchungen zur Wärmeabführung aus Kompaktbaugruppen der Elektronik unter Nutzung eines Finite-Element-Programms. Preview this item
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Untersuchungen zur Wärmeabführung aus Kompaktbaugruppen der Elektronik unter Nutzung eines Finite-Element-Programms.

Author: Hartmut Kühn
Publisher: [S.l.] : [s.n.], 1987.
Dissertation: Dresden, Techn. Univ., Diss. A, 1988 (Nicht für den Austausch).
Edition/Format:   Thesis/dissertation : Thesis/dissertation : GermanView all editions and formats
Database:WorldCat
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Material Type: Thesis/dissertation
Document Type: Book
All Authors / Contributors: Hartmut Kühn
OCLC Number: 75260610
Notes: Erscheint in 2 Bd.
Description: 116, [60] Bl. : Ill., graph. Darst. ; 30 cm.

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